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US 12,476,556 B2Granted
Low inductance bus assembly and power converter apparatus including the same
AssigneeEaton Intelligent Power Limited
InventorGeraldo Nojima
Life of this patent
Estimating the term…
Abstract
An apparatus, such as a power converter, includes first, second and third core bus plates arranged in parallel. The apparatus also includes a first bus extension plate joined to the first core bus plate and extending therefrom at a first angle and a second bus extension plate joined to the second core bus plate and extending therefrom at a second angle. The apparatus further includes a third bus extension plated joined with the third core bus plate and disposed parallel to the first bus extension plate and a fourth bus extension plate joined with the third core bus plate and disposed parallel to the second bus extension plate.
Claims19
An apparatus comprising:
- first and second semiconductor switching devices disposed opposite one another at respective ones of opposing first and second surfaces;
- a first bus comprising a first conductive plate disposed between the first and second surfaces and extending in a first direction towards the first surface to electrically connect to the first semiconductor switching device;
- a second bus comprising a second conductive plate disposed between the first and second surfaces and extending in a second direction opposite to the first direction towards the second surface to electrically connect to the second semiconductor switching device;
- and
- a third bus comprising:
- a third conductive plate disposed parallel to the first conductive plate and electrically connected to the first semiconductor switching device;
- a fourth conductive plate disposed parallel to the second conductive plate and electrically connected to the second semiconductor switching device and the third conductive plate;
- and
- wherein each of the first conductive plate and the second conductive plate is joined to the third conductive plate and the fourth conductive plate by an arcuate joint, the arcuate joint comprising a rounded cross-section configured to maintain a continuous conductive path.
6 more elements
A bus assembly for connection to semiconductor switching devices, the bus assembly comprising:
- a first bus comprising a first conductive plate disposed between opposing first and second surfaces and extending in a first direction towards the first surface, the first conductive plate configured to electrically connect to a first semiconductor switching device disposed at the first surface;
- a second bus comprising a second conductive plate disposed between the first and second surfaces and extending in a second direction opposite to the first direction towards the second surface, the second conductive plate configured to electrically connect to a second semiconductor switching device disposed at the second surface;
- and
- a third bus comprising:
- a third conductive plate disposed parallel to the first conductive plate and configured to electrically connect to the first semiconductor switching device;
- and
- a fourth conductive plate disposed parallel to the second conductive plate and electrically connected to the third conductive plate, the fourth conductive plate configured to electrically connect to the second semiconductor switching device,
- wherein the first, second, and third conductive plates are arranged in a stacked parallel configuration, with the third conductive plate positioned between the first and second conductive plates, and
- wherein the first conductive plate of the first bus includes a first bus extension plate extending in a direction perpendicular to a plane of the first conductive plate, and the second conductive plate includes a second bus extension plate extending in a direction perpendicular to a plane of the second conductive plate, the first and second bus extension plates extending in opposing directions.
6 more elements
An apparatus comprising:
- first and second semiconductor switching devices disposed opposite one another at respective ones of opposing first and second surfaces;
- a first bus comprising a first conductive plate disposed between the first and second surfaces and extending in a first direction towards the first surface to electrically connect to the first semiconductor switching device;
- a second bus comprising a second conductive plate disposed between the first and second surfaces and extending in a second direction opposite to the first direction towards the second surface to electrically connect to the second semiconductor switching device;
- and
- a third bus comprising:
- a third conductive plate disposed parallel to the first conductive plate and electrically connected to the first semiconductor switching device;
- and
- a fourth conductive plate disposed parallel to the second conductive plate and electrically connected to the second semiconductor switching device and the third conductive plate,
- wherein the first, second, and third conductive plates are arranged in a stacked parallel configuration within the apparatus, with the third conductive plate positioned between the first and second conductive plates.
6 more elements
Dependencies are inferred from the claim text.