H05K 7/023
Stackable modules
Official title: {Stackable modules}
H05K7/023 (Stackable modules) appears on 336 US grants and 228 published applications in this corpus.
Search patents in H05K- Granted patents
- 336
- Published applications
- 228
- Assignees
- 187
- Inventors
- 677
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 5 | 0 |
| 1993 | 9 | 0 |
| 1994 | 14 | 0 |
| 1995 | 11 | 0 |
| 1996 | 22 | 0 |
| 1997 | 13 | 0 |
| 1998 | 8 | 0 |
| 1999 | 16 | 0 |
| 2000 | 11 | 0 |
| 2001 | 14 | 5 |
| 2002 | 5 | 6 |
| 2003 | 6 | 6 |
| 2004 | 7 | 2 |
| 2005 | 1 | 5 |
| 2006 | 4 | 3 |
| 2007 | 3 | 2 |
| 2008 | 3 | 2 |
| 2009 | 1 | 2 |
| 2010 | 3 | 1 |
| 2011 | 1 | 2 |
| 2012 | 1 | 2 |
| 2013 | 0 | 3 |
| 2014 | 0 | 6 |
| 2015 | 4 | 8 |
| 2016 | 7 | 14 |
| 2017 | 6 | 21 |
| 2018 | 16 | 16 |
| 2019 | 23 | 18 |
| 2020 | 14 | 37 |
| 2021 | 17 | 12 |
| 2022 | 13 | 7 |
| 2023 | 22 | 15 |
| 2024 | 15 | 13 |
| 2025 | 13 | 5 |
| 2026 | 4 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Submodule1 Sep 2026US 12,726,006 B2Hyosung Heavy Industries Corporation
- Modular surgical energy system19 May 2026US 12,629,194 B2Cilag GmbH International
- Vertical power supply system and manufacturing method of connection board21 Apr 2026US 12,610,453 B2Delta Electronics (Shanghai) Co., Ltd.
- Electronic casing comprising electronic boards3 Mar 2026US 12,568,591 B2Sagemcom Broadband SAS
- Mounting assembly for mounting at least two electrical modules arrangeable at different levels above one another, and device assembly comprising such mounting assembly25 Nov 2025US 12,484,174 B2Phoenix Contact GmbH & Co.KG
- Converter tower with electromagnetic interference suppressor, and converter installation1 Oct 2026US 2026/0304665 A1Siemens Energy Global GmbH & Co. KG
- Vertical power supply system24 Sep 2026US 2026/0293020 A1Delta Electronics, Inc.
- Power Electronics Module and Electric Motor24 Sep 2026US 2026/0293021 A1Innomotics GmbH
- Method for mechanical packaging for modular energy system17 Sep 2026US 2026/0282262 A1Cilag GmbH International
- Method for constructing and using a modular surgical energy system with multiple devices6 Aug 2026US 2026/0224264 A1Cilag GmbH International
Most cited
By later US patents
- High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias430US 5,128,831 AMicron Technology, Inc. · 1992
- Three dimensional integrated circuit package361US 5,016,138 A1991
- Ultra high density integrated circuit packages method357US 5,279,029 AStaktek Corporation · 1994
- Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip336US 5,347,428 AIrvine Sensors Corporation · 1994
- High-density electronic modules - process and product240US 4,983,533 AIrvine Sensors Corporation · 1991