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US 5,347,428 AGranted
Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
AssigneeIrvine Sensors Corporation
InventorsJohn C. Carson, Ronald J. Indin, Stuart N. Shanken
Life of this patent
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Abstract
A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.
Claims26
A computer module comprising:
- an integrated circuit microprocessor chip containing computer circuitry:
- a stack of glued together integrated circuit memory chips, each containing memory circuitry dedicated to the computer module;
- terminals formed on the microprocessor chip, including memory-interface terminals connected to the computer circuitry contained in the microprocessor chip;
- the stack of memory chips having a planar access surface to which an array of spaced electrical leads extend from the memory circuitry;
- means for electrically connecting each memory-interface terminal on the microprocessor chip to at least one of the leads at the access surface of the stack of memory chips;
- and
- means for structurally integrating the stack of memory chips and the microprocessor chip to constitute a computer module.
4 more elements
A method of fabricating a computer module, comprising;
- providing an integrated circuit microprocessor chip containing computer circuitry and having a plurality of terminals connected to its computer circuitry, including memory-interface terminals;
- providing a glued together stack of integrated circuit memory chips having electrical leads extending to an access surface of the stack;
- structurally integrating the stack and the microprocessor chip to constitute a computer module;
- and
- electrically connecting the memory-interface terminals of the microprocessor chip to the electrical leads at the access surface of the stack.
2 more elements
Dependencies are inferred from the claim text.