H05K 5/0047
Having a two-part housing enclosing a pcb
Official title: {having a two-part housing enclosing a PCB}
H05K5/0047 (Having a two-part housing enclosing a pcb) appears on 709 US grants and 858 published applications in this corpus.
Search patents in H05K- Granted patents
- 709
- Published applications
- 858
- Assignees
- 393
- Inventors
- 1,912
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 6 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 1 |
| 2002 | 5 | 3 |
| 2003 | 6 | 5 |
| 2004 | 5 | 5 |
| 2005 | 3 | 9 |
| 2006 | 6 | 4 |
| 2007 | 4 | 10 |
| 2008 | 2 | 10 |
| 2009 | 7 | 9 |
| 2010 | 7 | 7 |
| 2011 | 5 | 11 |
| 2012 | 6 | 10 |
| 2013 | 6 | 19 |
| 2014 | 13 | 27 |
| 2015 | 24 | 51 |
| 2016 | 44 | 35 |
| 2017 | 43 | 54 |
| 2018 | 38 | 58 |
| 2019 | 70 | 94 |
| 2020 | 83 | 68 |
| 2021 | 60 | 60 |
| 2022 | 51 | 54 |
| 2023 | 42 | 53 |
| 2024 | 46 | 63 |
| 2025 | 52 | 87 |
| 2026 | 45 | 51 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Vehicle-mounted power supply apparatus with upper and lower cooling channels and vehicle6 Oct 2026US 12,757,361 B2Huawei Digital Power Technologies Co., Ltd.
- Electronic device with metallized plastic housing structure15 Sep 2026US 12,739,991 B2Wistron Neweb Corp.
- Electronic devices and electronic device systems1 Sep 2026US 12,727,095 B2Samsung Electronics Co., Ltd.
- Electronic apparatus having a flat rectangular chassis18 Aug 2026US 12,713,541 B2Lenovo (Singapore) Pte. Ltd.
- Electronic control unit18 Aug 2026US 12,713,566 B2Veoneer Sweden Safety Systems AB
- Portable power case with lithium iron phosphate battery17 Sep 2026US 2026/0280320 A1LAT Enterprises, Inc., d/b/a MediPak Energy Systems
- Integrated device package with carrier17 Sep 2026US 2026/0282981 A1Skyworks Solutions, Inc.
- Electronic housing27 Aug 2026US 2026/0255504 A1Phoenix Contact GmbH & Co.KG
- Electronic control device27 Aug 2026US 2026/0255505 A1Astemo, Ltd.
- Electronic device20 Aug 2026US 2026/0247545 A1Astemo, Ltd.
Most cited
By later US patents
- Molded housing with EMI shield119US 5,872,332 ADelco Electronics Corporation · 1999
- Flexible substrate electronic assembly83US 5,276,418 AMotorola, Inc. · 1994
- Waterproof casing having respiration filter for containing electronic components70US 7,465,887 B2Denso Corporation · 2008
- Casing for electronic control devices58US 6,407,925 B1Denso Corporation · 2002
- Electronic control unit and waterproof case57US 7,936,566 B2Hitachi, Ltd. · 2011