Electronic device with metallized plastic housing structure
AssigneeWistron Neweb Corp.
InventorsYu-Fu Kuo, Yuan-Chin Hsu, Hsiao-Chan Chang
Life of this patent
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Abstract
An electronic device includes a housing, a first metal trace, a conductive pillar, a circuit board, and a metal connecting element. The housing includes a conductive via and a concave hole, and the conductive via passes through the housing. The first metal trace is disposed on an inner surface of the housing, and the conductive via is electrically connected to the first metal trace. The conductive pillar is disposed in the concave hole and exposed from the housing, and the conductive pillar is electrically connected to the conductive via. The circuit board is disposed inside the housing. The metal connecting element is disposed on the circuit board and electrically connected to the first metal trace.
Claims13
An electronic device, comprising:
- a housing comprising a conductive via and a concave hole, wherein the conductive via is located outside the concave hole and passes through the housing;
- a first metal trace disposed on an inner surface of the housing, the conductive via electrically connected to the first metal trace;
- a conductive pillar disposed in the concave hole and exposed from the housing, the conductive pillar electrically connected to the conductive via;
- a second metal trace disposed on an outer surface of the housing, wherein the concave hole is adjacent to the conductive via, one end of the second metal trace is electrically connected to the conductive via, and another end of the second metal trace is extended into the concave hole and electrically connected to the conductive pillar;
- a circuit board disposed inside the housing;
- and
- a metal connecting element disposed on the circuit board and electrically connected to the first metal trace.
An electronic device, comprising:
- a housing comprising a conductive via and a concave hole, wherein the conductive via includes a through hole passing through the housing and a metal layer disposed on an inner surface of the through hole;
- a first metal trace disposed on an inner surface of the housing, the conductive via electrically connected to the first metal trace;
- a conductive pillar disposed in the concave hole and exposed from the housing, the conductive pillar electrically connected to the conductive via;
- a circuit board disposed inside the housing;
- a metal connecting element disposed on the circuit board and electrically connected to the first metal trace;
- and
- a metal portion disposed on a bottom surface of the concave hole, wherein the concave hole is communicated with the conductive via, the metal portion is electrically connected to the conductive pillar and the conductive via, and the metal portion is disposed between the conductive via and the conductive pillar.
Dependencies are inferred from the claim text.