H05K 5/006
Characterized by features for holding the pcb within the housing
Official title: {characterized by features for holding the PCB within the housing}
H05K5/006 (Characterized by features for holding the pcb within the housing) appears on 244 US grants and 306 published applications in this corpus.
Search patents in H05K- Granted patents
- 244
- Published applications
- 306
- Assignees
- 187
- Inventors
- 711
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 1 |
| 2003 | 2 | 3 |
| 2004 | 2 | 1 |
| 2005 | 2 | 2 |
| 2006 | 2 | 2 |
| 2007 | 1 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 3 |
| 2010 | 0 | 3 |
| 2011 | 1 | 6 |
| 2012 | 3 | 6 |
| 2013 | 3 | 5 |
| 2014 | 5 | 8 |
| 2015 | 8 | 13 |
| 2016 | 13 | 13 |
| 2017 | 11 | 16 |
| 2018 | 8 | 24 |
| 2019 | 25 | 30 |
| 2020 | 38 | 33 |
| 2021 | 22 | 23 |
| 2022 | 22 | 13 |
| 2023 | 14 | 23 |
| 2024 | 15 | 19 |
| 2025 | 20 | 46 |
| 2026 | 15 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic devices and electronic device systems1 Sep 2026US 12,727,095 B2Samsung Electronics Co., Ltd.
- Electronic control unit18 Aug 2026US 12,713,566 B2Veoneer Sweden Safety Systems AB
- Capacitor bank assembly for devices used in an aftertreatment system23 Jun 2026US 12,666,548 B2Cummins Emission Solutions Inc.
- Electronic apparatus23 Jun 2026US 12,666,549 B2Tyco Electronics AMP Qingdao Ltd.
- Hardware receiver and support set for internet of things (iot) system developers16 Jun 2026US 12,656,837 B2
- Electronic housing27 Aug 2026US 2026/0255504 A1Phoenix Contact GmbH & Co.KG
- Electronic control device27 Aug 2026US 2026/0255505 A1Astemo, Ltd.
- Electric/electronic equipment and method for manufacturing same6 Aug 2026US 2026/0231342 A1LG Innotek Co., Ltd.
- Electronic device for industrial machine23 Jul 2026US 2026/0214813 A1Asahi Denso Co., Ltd.
- Case for an electronic device, method of fabrication and storage device using the same16 Jul 2026US 2026/0206149 A1SK hynix Inc.
Most cited
By later US patents
- Flexible substrate electronic assembly83US 5,276,418 AMotorola, Inc. · 1994
- Electronic circuit apparatus53US 4,858,071 AMatsushita Electric Industrial Co., Ltd. · 1989
- Vehicle electronic module with integral mounting and grounding means51US 5,608,611 AUnited Technologies Automotive, Inc./Ford Motor Company · 1997
- Fastenerless sealed electronic module51US 5,703,754 ADelco Electronics Corporation · 1997
- Electrical connector housing for circuit board assembly38US 5,920,459 AThe Whitaker Corporation · 1999