H05K 3/103
By bonding or embedding conductive wires or strips
Official title: {by bonding or embedding conductive wires or strips}
H05K3/103 (By bonding or embedding conductive wires or strips) appears on 296 US grants and 306 published applications in this corpus.
Search patents in H05K- Granted patents
- 296
- Published applications
- 306
- Assignees
- 245
- Inventors
- 715
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 5 | 0 |
| 1985 | 6 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 0 | 1 |
| 2002 | 5 | 4 |
| 2003 | 1 | 1 |
| 2004 | 5 | 6 |
| 2005 | 2 | 2 |
| 2006 | 1 | 6 |
| 2007 | 3 | 4 |
| 2008 | 1 | 5 |
| 2009 | 3 | 6 |
| 2010 | 2 | 7 |
| 2011 | 3 | 9 |
| 2012 | 1 | 5 |
| 2013 | 3 | 7 |
| 2014 | 4 | 14 |
| 2015 | 10 | 21 |
| 2016 | 15 | 26 |
| 2017 | 18 | 22 |
| 2018 | 17 | 15 |
| 2019 | 23 | 15 |
| 2020 | 27 | 27 |
| 2021 | 12 | 25 |
| 2022 | 24 | 20 |
| 2023 | 8 | 19 |
| 2024 | 21 | 25 |
| 2025 | 21 | 7 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board assembly and method of manufacturing the same, packaging structure having the same1 Sep 2026US 12,727,091 B2Avary Holding (Shenzhen) Co., Limited.
- Electromagnetic wave shielding sheet, flexible printed circuit board attached with electromagnetic wave shielding sheet, and manufacturing method thereof26 May 2026US 12,641,709 B2Wisol Co., Ltd.
- Printed circuit board and preparation method thereof, and electronic communication device19 May 2026US 12,635,068 B2Huawei Technologies Co., Ltd.
- Electronic device31 Mar 2026US 12,593,401 B2Magnolia White Corporation
- Package structure with inductor, and manufacturing method thereof10 Feb 2026US 12,550,261 B2Jcet Group Co., Ltd.
- Method for manufacturing embedded trace substrate8 Oct 2026US 2026/0313809 A1Nissha Co., Ltd.
- Method for manufacturing wiring board, method for manufacturing semiconductor device, wiring board, and semiconductor device24 Sep 2026US 2026/0292975 A1Resonac Corporation
- Printed circuit board and preparation method thereof, and electronic communication device20 Aug 2026US 2026/0247524 A1Huawei Technologies Co., Ltd.
- Light-emitting module, method of manufacturing wiring substrate, and method of manufacturing light-emitting module4 Jun 2026US 2026/0156753 A1Nichia Corporation
- Ceramic circuit board and method for manufacturing same19 Mar 2026US 2026/0082479 A1Niterra Materials Co., Ltd.
Most cited
By later US patents
- Composite elastic and wire fabric for physiological monitoring apparel198US 6,341,504 B12002
- Method of making a wire harness111US 5,598,627 ASumitomo Wiring Systems, Ltd. · 1997
- Method of making flexible electronic circuitry92US 6,493,933 B1Massachusetts Institute of Technology · 2002
- Circuit boards using heat resistant resin for adhesive layers88US 6,121,553 AHitachi Chemical Company, Ltd. · 2000
- Flexible light display with evenly distributed illumination82US 4,439,818 A1984