Method of making a wire harness
AssigneeSumitomo Wiring Systems, Ltd.
InventorsKazuhito Saka, Masayoshi Hashimoto, Kou Furuta, Takahiro Okamura
Life of this patent
Estimating the term…
Loading patent…
AssigneeSumitomo Wiring Systems, Ltd.
InventorsKazuhito Saka, Masayoshi Hashimoto, Kou Furuta, Takahiro Okamura
Estimating the term…
A wire harness includes a main circuit part 1 including an insulated conductor wiring circuit plate 3 in which conductors 8 are arranged on a base insulation film 9 to form a wiring circuit by turning, bowing, crossing, or branching the conductors and covered with a flexible insulation film 12. Further, a branched connection part 2 is provided including a printed circuit plate 4 connected to a connecting area 14A in the main circuit part 1 through a connecting area 14B formed thereon and adapted to receive leading electrical wires 5. The conductor wiring circuit plate 30 is a flexible circuit plate which has an insulation base film 33, conductors 31 juxtaposed on the base film, an upper coverlet film 32, and a connecting area 36 for the conductors 31 having an adhesive layer 37 on the back side of the film 32. The connecting area 36 is formed by removing a predetermined width 38 of the base film 33 along the lateral direction of the coverlet film 32.
A method of making a wire harness, comprising the steps of:
Dependencies are inferred from the claim text.