H05K 2203/168
Wrong mounting prevention
H05K2203/168 (Wrong mounting prevention) appears on 120 US grants and 120 published applications in this corpus.
Search patents in H05K- Granted patents
- 120
- Published applications
- 120
- Assignees
- 117
- Inventors
- 291
- Latest grant
- 12 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 2 | 7 |
| 2003 | 4 | 3 |
| 2004 | 7 | 7 |
| 2005 | 5 | 8 |
| 2006 | 3 | 13 |
| 2007 | 3 | 6 |
| 2008 | 4 | 8 |
| 2009 | 5 | 5 |
| 2010 | 7 | 6 |
| 2011 | 3 | 1 |
| 2012 | 7 | 3 |
| 2013 | 1 | 1 |
| 2014 | 0 | 2 |
| 2015 | 3 | 6 |
| 2016 | 3 | 0 |
| 2017 | 2 | 3 |
| 2018 | 0 | 1 |
| 2019 | 3 | 7 |
| 2020 | 4 | 4 |
| 2021 | 4 | 3 |
| 2022 | 2 | 4 |
| 2023 | 5 | 9 |
| 2024 | 5 | 6 |
| 2025 | 7 | 3 |
| 2026 | 0 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board12 Aug 2025US 12,389,552 B2Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board module and electronic device comprising same1 Jul 2025US 12,349,280 B2LG Innotek Co., Ltd.
- Methods and systems for printed circuit board component placement and approval10 Jun 2025US 12,327,073 B2Boardera Software Inc.
- Flexible printed circuit board and electronic device including the same18 Mar 2025US 12,256,495 B2Samsung Electronics Co., Ltd.
- Sparse programming image validation11 Feb 2025US 12,223,303 B2NVIDIA Corporation
- Electrical and electronic component and method of manufacturing electrical and electronic component21 May 2026US 2026/0143594 A1Alps Alpine Co., Ltd.
- Pcb stencil printing with shrinkage compensation23 Apr 2026US 2026/0113851 A1International Business Machines Corporation
- Printed board, image forming apparatus, and mounting method12 Mar 2026US 2026/0072392 A1Canon Kabushiki Kaisha
- Method for accommodating substrate warpage in printed circuit board assemblies26 Jun 2025US 2025/0212320 A1Rockwell Collins, Inc.
- Flexible printed circuit board and electronic device including the same5 Jun 2025US 2025/0185167 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Electrical connector75US 7,361,059 B2Sandisk Secure Content Solutions, Inc · 2008
- Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates60US 5,034,802 AHewlett-Packard Company · 1991
- Electrical connector50US 7,500,861 B2Sandisk Secure Content Solutions, Inc · 2009
- Protection of computer system against incorrect card insertion during start-up42US 5,805,903 ACompaq Computer Corporation · 1998
- Surface mounting type polar electronic component40US 5,446,623 ARohm Co., Ltd. · 1995