Electrical and electronic component and method of manufacturing electrical and electronic component

A method of manufacturing an electrical and electronic component, the electrical and electronic component including a substrate having a mounting surface whose normal direction coincides with a first direction;

• and a position detection device mounted on the mounting surface,
• the position detection device including
• a first body part including a first fixed portion fixed via a solder to a pad provided on the mounting surface;
• a second body part being displaceable relative to the first body part and at which a detection object is fixable;
• a detection mechanism configured to measure a relative displacement between the first body part and the second body part;
• and
• a first reference part extending from the first body part in a direction intersecting the first direction, the first reference part having a reference surface whose in-plane direction coincides with the first direction,
• the reference surface including a second-direction-side reference surface that faces toward one side in a second direction that is one of in-plane directions of an intersecting plane intersecting the first direction,
• the substrate including a contact portion that is in contact with the reference surface,
• the contact portion including a second-direction-side contact portion that positions the detection mechanism by being in contact with the second-direction-side reference surface,
• the method of manufacturing an electrical and electronic component comprising:
• a mounting step of mounting the position detection device onto the mounting surface of the substrate such that the pad and the first fixed portion face each other via the solder;
• and
• a reflow step of melting the solder and solidifying the molten solder such that the first fixed portion is fixed to the pad via the solder,
• wherein, at a completion of the mounting step,
• the second-direction-side reference surface and the second-direction-side contact portion are out of contact with each other;
• and
• a second center that is a center of the pad is located on the one side in the second direction relative to a first center that is a center of the first fixed portion, and
• wherein, at a completion of the reflow step,
• the first center is located on the one side in the second direction relative to a position of the first center at the completion of the mounting step;
• and
• the detection mechanism is positioned with the second-direction-side reference surface and the second-direction-side contact portion being in contact with each other.