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US 12,349,280 B2Granted
Printed circuit board module and electronic device comprising same
AssigneeLG Innotek Co., Ltd.
InventorsSeung Min Lee, Kwang Soon Jung
Life of this patent
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Abstract
A printed circuit board module comprises: a first substrate; a second substrate disposed on the first substrate and including a first region and a second region; a first element disposed on the front surface of the first region; and a second element disposed on the front surface of the second region, wherein the lower end of the first region and the lower end of the second region are disposed in a stepped manner.
Claims20
A printed circuit board module comprising:
- a first substrate;
- a second substrate being disposed on the first substrate and including a first region and a second region;
- a first element being disposed on a front surface of the first region;
- and
- a second element being disposed on a front surface of the second region,
- wherein a lower end of the first region and a lower end of the second region are disposed in a stepped manner,
- wherein the first substrate includes a first coupling hole to which the first element is coupled and a second coupling hole to which the second substrate is coupled,
- wherein the lower end of the first region is spaced apart from an upper surface of the first substrate,
- wherein the lower end of the second region is in contact with the upper surface of the first substrate,
- wherein a coupling part protruded downward is disposed at the lower end of the second region,
- wherein the coupling part is coupled to the second coupling hole,
- wherein the first element includes a lead that protrudes downward from the lower end of the first region and is coupled to the first coupling hole,
- wherein the first element is electrically connected to the first substrate through the lead, and
- wherein the second element is electrically connected to the first substrate through a connection between the coupling part and the second coupling hole.
11 more elements
An electronic device including:
- a housing;
- and
- a printed circuit board module being disposed inside the housing,
- wherein the printed circuit board module includes:
- a first substrate;
- a second substrate being disposed on the first substrate and including a first region and a second region;
- a first element being disposed on a front surface of the first region;
- and
- a second element being disposed on a front surface of the second region, and
- wherein a lower end of the first region and a lower end of the second region are disposed in a stepped manner, and
- wherein the first substrate includes a first coupling hole to which the first element is coupled and a second coupling hole to which the second substrate is coupled,
- wherein the lower end of the first region is spaced apart from an upper surface of the first substrate,
- wherein the lower end of the second region is in contact with the upper surface of the first substrate,
- wherein a coupling part protruded downward is disposed at the lower end of the second region,
- wherein the coupling part is coupled to the second coupling hole,
- wherein the first element includes a lead that protrudes downward from the lower end of the first region and is coupled to the first coupling hole,
- wherein the first element is electrically connected to the first substrate through the lead, and
- wherein the second element is electrically connected to the first substrate through a connection between the coupling part and the second coupling hole.
15 more elements
Dependencies are inferred from the claim text.