H05K 2203/166
Alignment or registration
Official title: Alignment or registration; Control of registration
H05K2203/166 (Alignment or registration) appears on 543 US grants and 601 published applications in this corpus.
Search patents in H05K- Granted patents
- 543
- Published applications
- 601
- Assignees
- 343
- Inventors
- 1,266
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 7 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 10 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 7 | 0 |
| 1999 | 7 | 0 |
| 2000 | 11 | 0 |
| 2001 | 10 | 4 |
| 2002 | 14 | 13 |
| 2003 | 13 | 10 |
| 2004 | 7 | 6 |
| 2005 | 3 | 14 |
| 2006 | 10 | 15 |
| 2007 | 6 | 24 |
| 2008 | 13 | 28 |
| 2009 | 12 | 35 |
| 2010 | 14 | 25 |
| 2011 | 18 | 16 |
| 2012 | 18 | 30 |
| 2013 | 22 | 19 |
| 2014 | 22 | 26 |
| 2015 | 20 | 23 |
| 2016 | 21 | 22 |
| 2017 | 25 | 28 |
| 2018 | 22 | 47 |
| 2019 | 34 | 44 |
| 2020 | 36 | 35 |
| 2021 | 32 | 37 |
| 2022 | 37 | 27 |
| 2023 | 29 | 20 |
| 2024 | 14 | 21 |
| 2025 | 15 | 19 |
| 2026 | 8 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium8 Sep 2026US 12,733,455 B2Yamaha Robotics Co., Ltd.
- Press-in machine for pressing components into a substrate, in particular into a printed circuit board or carrier plate, with substrate positioning11 Aug 2026US 12,707,617 B2ERSA GmbH
- Solder joint inspection features21 Jul 2026US 12,690,138 B2Kollmorgen Corporation
- Display device16 Jun 2026US 12,656,644 B2Samsung Display Co., Ltd.
- Electrical feed connector system and method for light emitting diode (LED) circuit boards with varied placement of wire terminal connection points17 Mar 2026US 12,580,330 B2
- Precision alignment features for high density interconnects16 Jul 2026US 2026/0206605 A1Raytheon Company
- Pattern recognition system and method for digital printed circuit board assembly9 Jul 2026US 2026/0197945 A1National Technical University of Athens
- Display device and display panel2 Jul 2026US 2026/0190692 A1LG Display Co., Ltd.
- System and method for positioning a reflector on printed circuit board18 Jun 2026US 2026/0168651 A1Valeo Vision
- Electronic component, electric device including the same, and bonding method thereof14 May 2026US 2026/0136465 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Heat sink for semiconductor device assembly134US 5,311,060 ALSI Logic Corporation · 1994
- Vehicle vision system camera assembly with coaxial connector81US 9,609,757 B2Magna Electronics Inc. · 2017
- Vernier structure for flip chip bonded devices64US 5,022,580 APlessey Overseas Limited · 1991
- Integral dam and heat sink for semiconductor device assembly63US 5,227,663 ALSI Logic Corporation · 1993
- Self-aligning electrical contact array52US 5,381,307 AMotorola, Inc. · 1995