Integral dam and heat sink for semiconductor device assembly
AssigneeLSI Logic Corporation
InventorsSadanand Patil, Adrian Murphy, Keith Newman
Life of this patent
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Abstract
A metallic or ceramic dam structure surrounding a semiconductor die in a semiconductor device assembly is disclosed. The dam structure forms a cavity containing a potting compound encapsulating the die. The dam structure may also be provided with a flat lid portion, enclosing the cavity and forming a flat, exterior, heat-dissipating surface for the semiconductor device assembly. Further, an additional add-on structure, having heat dissipating fins, may be joined to the dam structure, exterior the semiconductor device assembly, to provide additional heat dissipation. The add-on structure is particularly well-suited to applications where air cooling is available.
Claims8
A semiconductor device assembly comprising:
- a die attach pad having a periphery;
- a die having a top surface containing circuit elements and a bottom surface, mounted by its bottom surface atop the die attach pad;
- a plurality of leads having inner ends and extending generally radially outwardly from adjacent the die attach pad;
- a first, segmented plastic film layer disposed atop the leads, a portion of the first plastic film layer bridging a gap between the inner ends of the leads and the die attach pad and leaving a portion of the leads exposed;
- a plurality of bond wires connecting the circuit elements of the top surface of the die to the exposed portions of the inner ends of the leads;
- a second plastic film layer disposed beneath the leads, and beneath the periphery of the die attach pad;
- a ring-like frame formed of anodized aluminum disposed atop the leads;
- epoxy disposed atop the leads, covering the circuit elements, completely encapsulating the die and extending to the ring-like frame, thereby forming an encapsulated semiconductor device assembly;
- and
- a first heat sink structure disposed atop the die, facing the circuit element containing top surface of the die, said first heat sink structure formed integrally with the ring-like frame, said first heat sink structure having a first surface in close proximity to the circuit element containing top surface of the die and in contact with the epoxy, and having a second surface forming a flat exterior surface for the semiconductor device.
A semiconductor device assembly comprising:
- a die attach pad having a periphery;
- a die having a top surface containing circuit elements and a bottom surface, mounted by its bottom surface atop the die attach pad;
- a plurality of leads having inner ends and extending generally radially outwardly from adjacent the die attach pad;
- a first, segmented plastic film layer disposed atop the leads, a portion of the first plastic film layer bridging a gap between the inner ends of the leads and the die attach pad and leaving a portion of the leads exposed;
- a plurality of bond wires connecting the circuit elements of the top surface of the die to the exposed portions of the inner ends of the leads;
- a second plastic film layer disposed beneath the leads, and beneath the periphery of the die attach pad;
- a ring-like frame formed of ceramic material disposed atop the leads;
- epoxy disposed atop the leads, covering the circuit elements, completely encapsulating the die and extending to the ring-like frame, thereby forming an encapsulated semiconductor device assembly;
- and
- a first heat sink structure disposed atop the die, facing the circuit element containing top surface of the die, said first heat sink structure formed integrally with the ring-like frame, said first heat sink structure having a first surface in close proximity to the circuit element containing top surface of the die and in contact with the epoxy, and having a second surface forming a flat exterior surface for the semiconductor device.
Dependencies are inferred from the claim text.