H05K 2203/165
Stabilizing
Official title: Stabilizing, e.g. temperature stabilization
H05K2203/165 (Stabilizing) appears on 49 US grants and 43 published applications in this corpus.
Search patents in H05K- Granted patents
- 49
- Published applications
- 43
- Assignees
- 41
- Inventors
- 136
- Latest grant
- 17 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 0 |
| 2002 | 3 | 2 |
| 2003 | 1 | 2 |
| 2004 | 1 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 3 |
| 2007 | 0 | 3 |
| 2008 | 0 | 2 |
| 2009 | 2 | 1 |
| 2010 | 0 | 8 |
| 2011 | 5 | 1 |
| 2012 | 3 | 0 |
| 2013 | 2 | 2 |
| 2014 | 0 | 3 |
| 2015 | 2 | 1 |
| 2016 | 1 | 1 |
| 2017 | 2 | 1 |
| 2018 | 2 | 2 |
| 2019 | 0 | 1 |
| 2020 | 2 | 1 |
| 2021 | 0 | 0 |
| 2022 | 1 | 3 |
| 2023 | 0 | 1 |
| 2024 | 3 | 2 |
| 2025 | 2 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Reel-to-reel circuit board manufacturing apparatus17 Mar 2026US 12,581,601 B2Haesung Ds Co., Ltd.
- Circuit board cooling configurations28 Oct 2025US 12,457,680 B2Microsoft Technology Licensing, LLC
- Network device with elevated temperature sensor14 Oct 2025US 12,446,156 B2Arista Networks, Inc.
- Maintaining the shape of a circuit board22 Oct 2024US 12,127,334 B2Dis Tech America, LLC
- Storage device unit20 Aug 2024US 12,069,796 B2Panasonic Intellectual Property Management Co., Ltd.
- Circuit Board Cooling Configurations29 Jan 2026US 2026/0032804 A1Microsoft Technology Licensing, LLC
- Automated control of an electrical connection joining process29 May 2025US 2025/0170664 A1Biosense Webster (Israel) Ltd.
- Network device with elevated temperature sensor21 Nov 2024US 2024/0389233 A1Arista Networks, Inc.
- Circuit Board Cooling Configurations19 Sep 2024US 2024/0314917 A1Microsoft Technology Licensing, LLC
- Reel-to-reel circuit board manufacturing apparatus30 Mar 2023US 2023/0101713 A1Haesung Ds Co., Ltd.
Most cited
By later US patents
- Laminated board for testing electronic components69US 4,978,914 AFurukawa Denki Kogyo Kabushiki Kaisha · 1990
- Heat distributor for electrical connector65US 6,740,820 B22004
- Multilayer circuit board with electrically resistive heating element58US 6,114,674 AMcDonnell Douglas Corporation · 2000
- Temperature controlled multi-layer module50US 5,539,186 AInternational Business Machines Corporation · 1996
- Self-heating circuit board48US 6,396,706 B1Credence Systems Corporation · 2002