H05K 2203/102
Using microwaves
Official title: Using microwaves, e.g. for curing ink patterns or adhesive
H05K2203/102 (Using microwaves) appears on 37 US grants and 40 published applications in this corpus.
Search patents in H05K- Granted patents
- 37
- Published applications
- 40
- Assignees
- 35
- Inventors
- 130
- Latest grant
- 28 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 1 | 3 |
| 2007 | 0 | 2 |
| 2008 | 1 | 3 |
| 2009 | 2 | 4 |
| 2010 | 3 | 2 |
| 2011 | 1 | 5 |
| 2012 | 1 | 0 |
| 2013 | 0 | 3 |
| 2014 | 1 | 2 |
| 2015 | 1 | 3 |
| 2016 | 3 | 3 |
| 2017 | 1 | 0 |
| 2018 | 2 | 1 |
| 2019 | 1 | 1 |
| 2020 | 1 | 1 |
| 2021 | 0 | 2 |
| 2022 | 1 | 2 |
| 2023 | 1 | 0 |
| 2024 | 2 | 1 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Applying a solderable surface to conductive ink28 Oct 2025US 12,457,693 B2International Business Machines Corporation
- Method of assessing ink deposition accuracy in an electronic device printing process17 Sep 2024US 12,096,567 B2Socovar, Societe en Commandite
- Reflector and light sintering apparatus comprising the same25 Jun 2024US 12,022,579 B2Iucf-Hyu (Industry-University Cooperation Foundation Hanyang University)
- Applying a solderable surface to conductive ink31 Oct 2023US 11,805,603 B2International Business Machines Corporation
- Display device having front panel laminate19 Jul 2022US 11,395,400 B2E Ink Holdings Inc.
- Applying a solderable surface to conductive ink15 Feb 2024US 2024/0057266 A1International Business Machines Corporation
- Mounting wiring board, electronic device mounting board, method of mounting electronic device, microwave heating method, and microwave heating apparatus22 Dec 2022US 2022/0402058 A1National Institute of Advanced Industrial Science and Technology
- Method of assessing ink deposition accuracy in an electronic device printing process15 Dec 2022US 2022/0400554 A1Socovar, Societe en Commandite
- Display device28 Jan 2021US 2021/0029820 A1E Ink Holdings Inc.
- Reflector and light sintering apparatus comprising the same7 Jan 2021US 2021/0007182 A1Iucf-Hyu (Industry-University Cooperation Foundation Hanyang University)
Most cited
By later US patents
- Printing of electronic circuits and components63US 6,855,378 B1SRI International · 2005
- Radiation stress relieving of sulfone polymer articles30US 4,339,303 AKollmorgen Technologies Corporation · 1982
- Radiation stress relieving of polymer articles28US 4,424,095 AKollmorgen Technologies Corporation · 1984
- Electrical, plating and catalytic uses of metal nanomaterial compositions21US 7,820,097 B2Ncc Nano, LLC · 2010
- Microwave treatment of photoresist on a substrate18US 5,296,271 AMotorola, Inc. · 1994