Lambda Technologies, Inc.
Morrisville, NC, US· latest recorded location
Lambda Technologies, Inc. is named on 16 US grants and 4 published applications in this corpus. Its most frequent classification is H05B (Electric heating).
- Granted patents
- 16
- Published applications
- 4
- Inventors
- 18
- Granted in 2026 so far
- 0
- Most recent grant
- 20 Sep 2011
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 3 | 2 |
By publication year.
Technology areas
Share of 20 documents
- H05BElectric heating12
- B29CShaping or joining of plastics6
- H05KPrinted circuits6
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered6
- G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of4
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by3
- Y10TTechnical subjects covered by former us classification3
- B05DProcesses for applying fluent materials to surfaces, in general2
- B07CPostal sorting2
- B24BMachines, devices, or processes for grinding or polishing2
Recent patents
- Method and apparatus for controlled thermal processing20 Sep 2011US 8,021,898 B2
- Method and apparatus for uniform microwave treatment of semiconductor wafers10 May 2011US 7,939,456 B2
- Resonating conductive traces and methods of using same for bonding components8 Mar 2011US 7,901,536 B2
- Systems and methods for processing pathogen-contaminated mail pieces29 Mar 2005US 6,872,927 B2
- Methods and apparatus of joining optically coupled optoelectronic and fiber optic components using electromagnetic radiation6 Jul 2004US 6,758,609 B2
- Method and apparatus for controlled thermal processing31 Mar 2011US 2011/0076786 A1
- Method and apparatus for uniform microwave treatment of semiconductor wafers31 Mar 2011US 2011/0076787 A1
- Methods and apparatus of joining optically coupled optoelectronic and fiber optic components using electromagnetic radiation11 Dec 2003US 2003/0228114 A1
- Systems and methods for processing pathogen-contaminated mail pieces17 Jul 2003US 2003/0132227 A1
Most cited
By later US patents
- Systems and methods for monitoring material properties using microwave energy65US 5,648,038 A1997
- Adhesive bonding using variable frequency microwave energy59US 5,804,801 A1998
- Curing polymer layers on semiconductor substrates using variable frequency microwave energy52US 5,879,756 A1999
- Adhesive bonding using variable frequency microwave energy49US 5,798,395 A1998
- Curing polymer layers on semiconductor substrates using variable frequency microwave energy27US 5,738,915 A1998