Methods and apparatus of joining optically coupled optoelectronic and fiber optic components using electromagnetic radiation

A method of joining optoelectronic components such that the optoelectronic components are optically coupled, comprising:

• positioning first and second optoelectronic components in adjacent relationship such that light signals can pass therebetween;
• passing light signals between the first and second optoelectronic components;
• aligning the first and second optoelectronic components relative to each other, comprising:
• detecting signal strength of the light signals passing between the first and second optoelectronic components;
• and
• moving the first and second optoelectronic components relative to each other until signal strength of the light signals passing between the first and second optoelectronic components is detected as being substantially maximized;
• and
• applying a curable resin having adhesive properties to an interface of the first and second optoelectronic components;
• irradiating the interface with electromagnetic radiation to partially cure the resin in response to detecting that signal strength of the light signals passing between the first and second optoelectronic components is substantially maximized, wherein portions of the first and/or second optoelectronic components are heated substantially simultaneously with irradiating the interface to facilitate curing of the resin;
• transporting the coupled first and second optoelectronic components to a curing oven;
• and
• subjecting the partially cured resin to conditions sufficient to fully cure the resin.

A method of joining optoelectronic components such that the optoelectronic components are optically coupled, comprising:

• positioning first and second optoelectronic components in adjacent relationship such that light signals can pass therebetween;
• applying a curable resin having adhesive properties to an interface of the first and second optoelectronic components;
• aligning the first and second optoelectronic components relative to each other;
• irradiating the interface with electromagnetic radiation for a first period of time to partially cure the resin, wherein portions of the first and/or second optoelectronic components are heated substantially simultaneously with irradiating the interface to facilitate curing of the resin;
• checking alignment of the first and second optoelectronic components relative to each other and, if required, aligning the first and second optoelectronic components relative to each other;
• and
• irradiating the interface with electromagnetic radiation for a second period of time to further cure the resin.

A method of joining optoelectronic components such that the optoelectronic components are optically coupled, comprising:

• positioning first and second optoelectronic components in adjacent relationship such that light signals can pass therebetween;
• applying a curable resin having adhesive properties to an interface of the first and second optoelectronic components;
• passing light signals between the first and second optoelectronic components;
• aligning the first and second optoelectronic components relative to each other, comprising:
• detecting signal strength of the tight signals passing between the first and second optoelectronic components;
• and
• moving the first and second optoelectronic components relative to each other, via a positioning apparatus configured to move the first and second optoelectronic components relative to each other in one or more of six degrees of freedom, until signal strength of the light signals passing between the first and second optoelectronic components is detected as being substantially maximized;
• and
• irradiating the interface with electromagnetic radiation to rapidly cure the resin in response to detecting that signal strength of the light signals passing between the first and second optoelectronic components is substantially maximized such that the aligned first and second optoelectronic components are fixedly joined;
• wherein the positioning apparatus comprises susceptor material that is configured to heat to a predetermined temperature in the presence of electromagnetic radiation and wherein irradiating the interface with electromagnetic radiation causes the susceptor material to heat to the predetermined temperature which, in turn, heats portions of the first and/or second optoelectronic components to a predetermined temperature.