Method and apparatus for uniform microwave treatment of semiconductor wafers

A method for processing semiconductor wafers comprising the steps of:

• a) supporting a semiconductor wafer to be processed on a dielectric supporting member within a microwave applicator cavity;
• b) introducing microwave energy into said applicator cavity;
• c) simultaneously measuring the temperature of said wafer at a first point near its center and at a second point near its periphery;
• and,
• d) supplying a controlled flow of gas proximate to the periphery of said wafer sufficient to provide differential cooling to the wafer edge relative to the wafer center.

A method for processing semiconductors comprising the steps of:

• a) supporting a generally planar semiconductor component to be processed on a dielectric supporting member within a microwave applicator cavity;
• b) introducing microwave energy into said applicator cavity;
• c) simultaneously measuring the temperature of said component at a first point near its center and at a second point near its periphery;
• and,
• d) supplying a controlled flow of gas proximate to the periphery of said component sufficient to provide differential cooling to the wafer edge relative to the wafer center.