Resonating conductive traces and methods of using same for bonding components
AssigneeLambda Technologies, Inc.
InventorsZakaryae Fathi, Steve Greathouse, Robert Hubbard, Iftikhar Ahmad
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Abstract
Conductive traces and patterns of same are used to bond components together via electromagnetic radiation. Each conductive trace is configured to resonate and heat up when irradiated with electromagnetic radiation, such as microwave energy and/or RF energy, having a wavelength that is about 2.3 times the length of the conductive trace. The conductive traces may be arranged in a pattern to uniformly heat a target area of a substrate or other component to a selected temperature when irradiated with electromagnetic radiation.
Claims17
A method of bonding components, comprising:
- positioning a first component in contacting relationship with a target area of a second component, wherein a conductive pattern is disposed at the target area, wherein the conductive pattern comprises a set of electrically isolated conductive traces in spaced-apart relationship, wherein each conductive trace is configured to uniformly heat the substrate target area to a selected temperature sufficient for the first and second components to fuse together when irradiated with electromagnetic radiation, and wherein each conductive trace comprises a base with spaced-apart, adjacent U-shaped legs extending from the base, wherein each U-shaped leg comprises a first elongated portion that contacts the base and a spaced-apart second elongated portion having a free end;
- and
- irradiating the conductive pattern with electromagnetic radiation such that the target area heats to the temperature and the first and second components fuse together at the target area.
A method of bonding components, comprising:
- positioning a first component in contacting relationship with a target area of a second component, wherein a conductive pattern is disposed at the target area, wherein the conductive pattern comprises a set of electrically isolated conductive traces in spaced-apart relationship, wherein each conductive trace is configured to uniformly heat the substrate target area to a selected temperature sufficient for the first and second components to fuse together when irradiated with electromagnetic radiation, wherein selected ones of the conductive traces heat to a first temperature when irradiated with electromagnetic radiation at a first frequency, and wherein selected other ones of the conductive traces heat to a second temperature different from the first temperature when irradiated with electromagnetic radiation at a second frequency different from the first frequency, and wherein each conductive trace comprises a base with spaced-apart, adjacent U-shaped legs extending from the base;
- and
- irradiating the conductive pattern with electromagnetic radiation such that the target area heats to the temperature and the first and second components fuse together at the target area.
Dependencies are inferred from the claim text.