Applying a solderable surface to conductive ink
AssigneeInternational Business Machines Corporation
InventorsMark K. Hoffmeyer, Prabjit Singh
Life of this patent
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Abstract
Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.
Claims9
An apparatus for applying a solderable surface to conductive ink, the apparatus comprising a computer processor, a computer memory operatively coupled to the computer processor, the computer memory having disposed within it computer program instructions that, when executed by the computer processor, cause the apparatus to carry out the steps of:
- partially curing a conductive ink trace;
- applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles;
- applying a magnetic field to the conductive paste prior to curing the partially cured conductive ink trace and the conductive paste;
- and
- curing the partially cured conductive ink trace and the conductive paste.
Dependencies are inferred from the claim text.