H05K 2203/086
Using an inert gas
H05K2203/086 (Using an inert gas) appears on 116 US grants and 66 published applications in this corpus.
Search patents in H05K- Granted patents
- 116
- Published applications
- 66
- Assignees
- 91
- Inventors
- 273
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 11 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 6 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 1 | 2 |
| 2002 | 4 | 5 |
| 2003 | 5 | 2 |
| 2004 | 2 | 3 |
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 5 |
| 2008 | 1 | 5 |
| 2009 | 0 | 5 |
| 2010 | 5 | 2 |
| 2011 | 2 | 1 |
| 2012 | 2 | 4 |
| 2013 | 1 | 0 |
| 2014 | 2 | 2 |
| 2015 | 1 | 3 |
| 2016 | 1 | 3 |
| 2017 | 3 | 1 |
| 2018 | 5 | 1 |
| 2019 | 1 | 5 |
| 2020 | 1 | 2 |
| 2021 | 2 | 4 |
| 2022 | 2 | 2 |
| 2023 | 1 | 3 |
| 2024 | 2 | 2 |
| 2025 | 3 | 1 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Radiant curtain heating assembly for wave soldering machine7 Jul 2026US 12,673,377 B2Illinois Tool Works Inc.
- Device for etching the periphery edge of a substrate and method for controlling etching thereof19 Aug 2025US 12,396,103 B2Device Co., Ltd.
- Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole1 Jul 2025US 12,349,287 B2Pac Tech—Packaging Technologies GmbH
- Hermetic coating of components29 Apr 2025US 12,289,840 B2Heraeus Medevio GmbH & Co. KG
- Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole2 Jul 2024US 12,028,987 B2Pac Tech—Packaging Technologies GmbH
- Production method of embedded circuit board10 Sep 2026US 2026/0271193 A1Olympic Circuit Technology Co., Ltd.
- Method for manufacturing conductive film and conductive film20 Aug 2026US 2026/0241712 A1Ricoh Company, Ltd.
- Heat dissipation substrate, heat dissipation circuit board, heat dissipation member, and method for manufacturing heat dissipation substrate5 Jun 2025US 2025/0185151 A1Kochi Prefectural Public University Corporation
- Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole7 Nov 2024US 2024/0373563 A1Pac Tech—Packaging Technologies GmbH
- Radiant curtain heating assembly for wave soldering machine25 Jul 2024US 2024/0246162 A1Illinois Tool Works Inc.
Most cited
By later US patents
- Method of making solder interconnection arrays87US 5,377,902 AMicroFab Technologies, Inc. · 1995
- Method of fabricating an electronic circuit device77US 5,865,365 AHitachi, Ltd. · 1999
- Method for making a ceramic multilayer structure having internal copper conductors56US 4,766,027 AE. I. Du Pont de Nemours and Company · 1988
- Closed-loop dual-cycle printed circuit board cleaning apparatus and method55US 5,201,958 AElectronic Controls Design, Inc. · 1993
- Thick film copper conductor patterning by laser51US 4,931,323 ATexas Instruments Incorporated · 1990