Method of making solder interconnection arrays

The method of making an interconnection array for joining a plurality of metallic surfaces located on a first body to a plurality of metallic surfaces located on a second body comprising the steps of:

• (a) positioning and maintaining a surface of a first body having a plurality of metallic surfaces thereon and the surface of a second body having a plurality of metallic surfaces thereon in a controlled environment;
• (b) aligning an ejection device capable of ejecting drops of liquid solder which can be varied in volume from drop to drop to deliver drops of liquid solder to an initial metallic surface on one of said first body and said second body;
• (c) moving said one of said first body and said second body sequentially through a predetermined plurality of locations;
• (d) activating said ejection device to cause a predetermined number of drops of liquid solder to be delivered to metallic surfaces on said one of said first body and said second body when positioned at each of said predetermined plurality of locations and form a solid solder deposit thereon which varies in diameter and height in accordance with a predetermined pattern.