H05K 2203/082
Suction
Official title: Suction, e.g. for holding solder balls or components
H05K2203/082 (Suction) appears on 340 US grants and 232 published applications in this corpus.
Search patents in H05K- Granted patents
- 340
- Published applications
- 232
- Assignees
- 206
- Inventors
- 771
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 5 | 0 |
| 1989 | 6 | 0 |
| 1990 | 10 | 0 |
| 1991 | 3 | 0 |
| 1992 | 10 | 0 |
| 1993 | 5 | 0 |
| 1994 | 9 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 14 | 0 |
| 1998 | 15 | 0 |
| 1999 | 14 | 0 |
| 2000 | 16 | 0 |
| 2001 | 22 | 9 |
| 2002 | 14 | 9 |
| 2003 | 16 | 12 |
| 2004 | 9 | 15 |
| 2005 | 10 | 17 |
| 2006 | 13 | 18 |
| 2007 | 12 | 10 |
| 2008 | 3 | 25 |
| 2009 | 15 | 22 |
| 2010 | 13 | 16 |
| 2011 | 15 | 13 |
| 2012 | 13 | 5 |
| 2013 | 9 | 9 |
| 2014 | 3 | 2 |
| 2015 | 6 | 5 |
| 2016 | 6 | 3 |
| 2017 | 2 | 3 |
| 2018 | 3 | 5 |
| 2019 | 3 | 4 |
| 2020 | 6 | 10 |
| 2021 | 7 | 6 |
| 2022 | 7 | 5 |
| 2023 | 5 | 1 |
| 2024 | 2 | 3 |
| 2025 | 1 | 2 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device and manufacturing method thereof31 Mar 2026US 12,593,399 B2Carux Technology Pte. Ltd.
- Large area laser printing system and method17 Feb 2026US 12,552,179 B2Reophotonics, Ltd.
- Ball attach tool9 Dec 2025US 12,495,504 B2Samsung Electronics Co., Ltd.
- Double-sided circuit non-oxide-based ceramic substrate and method for manufacturing same2 Jul 2024US 12,028,984 B2Hitachi Power Solutions Co., Ltd.
- Vacuum-assisted BGA joint formation16 Apr 2024US 11,963,307 B2International Business Machines Corporation
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
- Circuit board manufacturing device and circuit board manufacturing method30 Jul 2026US 2026/0223294 A1NHK Spring Co., Ltd.
- Method and device for depositing components on a substrate9 Jul 2026US 2026/0198152 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Contact arrangement having a welded flexible circuit board25 Sep 2025US 2025/0301573 A1
- Ball attach tool13 Mar 2025US 2025/0089179 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Sensor substrate and method of fabricating same207US 7,323,142 B2Medtronic MiniMed, Inc. · 2008
- Printed circuit board through hole technique143US 4,964,948 AProtoCAD, Inc. · 1990
- Method for attaching conductive balls to a substrate134US 5,284,287 AMotorola, Inc. · 1994
- Method of aligning and mounting solder balls to a substrate131US 5,118,027 AInternational Business Machines Corporation · 1992
- Solder ball interconnected assembly129US 5,591,941 AInternational Business Machines Corporation · 1997