H05K 2203/0505
Double exposure of the same photosensitive layer
H05K2203/0505 (Double exposure of the same photosensitive layer) appears on 58 US grants and 21 published applications in this corpus.
Search patents in H05K- Granted patents
- 58
- Published applications
- 21
- Assignees
- 32
- Inventors
- 95
- Latest grant
- 4 Oct 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 8 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 2 | 1 |
| 2004 | 1 | 0 |
| 2005 | 1 | 2 |
| 2006 | 1 | 3 |
| 2007 | 2 | 0 |
| 2008 | 0 | 1 |
| 2009 | 1 | 2 |
| 2010 | 0 | 4 |
| 2011 | 2 | 0 |
| 2012 | 1 | 1 |
| 2013 | 3 | 1 |
| 2014 | 1 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
| 2020 | 1 | 1 |
| 2021 | 1 | 2 |
| 2022 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Lithographic exposure system and method for exposure and curing a solder resist4 Oct 2022US 11,464,116 B2LIMATA GmbH
- Wired circuit board and production method thereof1 Mar 2022US 11,266,024 B2Nitto Denko Corporation
- Wired circuit board and production method thereof8 Jun 2021US 11,032,913 B2Nitto Denko Corporation
- Zero-misalignment via-pad structures5 May 2020US 10,645,813 B2Intel Corporation
- Zero-misalignment via-pad structures22 Jan 2019US 10,187,998 B2Intel Corporation
- Wired circuit board and production method thereof5 Aug 2021US 2021/0243900 A1Nitto Denko Corporation
- Direct Exposure Device for the Direct Exposure of Solder Resists in a 2-Dimensional, Quickly Temperature-Controlled Environment25 Mar 2021US 2021/0092850 A1LIMATA GmbH
- Wired circuit board and production method thereof29 Oct 2020US 2020/0344888 A1Nitto Denko Corporation
- Zero-misalignment via-pad structures16 May 2019US 2019/0150291 A1Intel Corporation
- Zero-misalignment via-pad structures28 Sep 2017US 2017/0280568 A1Intel Corporation
Most cited
By later US patents
- Excimer laser patterning of a novel resist114US 4,780,177 AGeneral Electric Company · 1988
- Polymeric sensitizers for photopolymer composition80US 4,565,769 AE. I. Du Pont de Nemours and Company · 1986
- Excimer laser patterning of a novel resist using masked and maskless process steps66US 4,842,677 AGeneral Electric Company · 1989
- Manufacturing method for a multilayer printed circuit board66US 5,092,032 AInternational Business Machines Corporation · 1992
- Process for the production of images after electrodeposition of positive photoresist on electrically conductive surface47US 4,632,900 ACiba-Geigy Corporation · 1986