H05K 2201/2063
Mixed adhesion layer containing metallic/inorganic and polymeric materials
Official title: mixed adhesion layer containing metallic/inorganic and polymeric materials
H05K2201/2063 (Mixed adhesion layer containing metallic/inorganic and polymeric materials) appears on 26 US grants and 20 published applications in this corpus.
Search patents in H05K- Granted patents
- 26
- Published applications
- 20
- Assignees
- 24
- Inventors
- 91
- Latest grant
- 15 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 2 |
| 2006 | 0 | 0 |
| 2007 | 1 | 3 |
| 2008 | 0 | 2 |
| 2009 | 0 | 0 |
| 2010 | 3 | 1 |
| 2011 | 0 | 2 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 2 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 1 | 2 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 2 |
| 2024 | 2 | 1 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Information handling systems with a flexible printed circuit tensioning system and methods of making the same15 Apr 2025US 12,279,375 B2Dell Products L. P.
- Support substrate and method for producing a support substrate24 Dec 2024US 12,177,970 B2Rogers Germany GmbH
- Display device23 Jan 2024US 11,882,649 B2Samsung Display Co., Ltd.
- Display device4 Oct 2022US 11,464,105 B2Samsung Display Co., Ltd.
- Method of manufacturing anisotropic conductive film using vertical ultrasonic waves2 Nov 2021US 11,161,988 B2Korea Advanced Institute of Science and Technology
- Adhesive composition, adhesive sheet, electromagnetic wave shield film, laminate, and printed circuit board16 Jan 2025US 2025/0019572 A1TOYOBO MC Corporation
- Information handling systems with a flexible printed circuit tensioning system and methods of making the same29 Aug 2024US 2024/0292542 A1Dell Products L. P.
- Support Substrate and Method for Producing a Support Substrate1 Jun 2023US 2023/0171887 A1Rogers Germany GmbH
- Display device9 Feb 2023US 2023/0042192 A1Samsung Display Co., Ltd.
- Display device19 Aug 2021US 2021/0259097 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Copper foil for printed wiring board41US 5,712,047 ANippon Denkai, Ltd. · 1998
- Method of making a printed circuit board having mutually etchable copper and nickel layers33US 4,190,474 AGould Inc. · 1980
- Enhanced adhesion between metals and polymers31US 4,720,401 AInternational Business Machines Corporation · 1988
- Copper clad laminate, multilayer printed circuit board and their processing method30US 5,569,545 ANippon Denkai, Ltd. · 1996
- Copper foil having bond strength26US 4,010,005 AMitsui-Anaconda Electro Copper Sheet Co., Ltd. · 1977