Copper foil having bond strength
AssigneeMitsui-Anaconda Electro Copper Sheet Co., Ltd.
InventorsShigeyoshi Morisaki, Kazuo Mase
Life of this patent
Estimating the term…
Abstract
A copper foil having high bond strength with an insoluble particle-containing metal plate formed thereon, the plated copper foil being adapted for use in the preparation of, for example, a printed circuit.
Claims11
A plated copper foil having high bond strength comprising a copper foil and an insoluble fine particle-containing metal plating formed thereon.
A copper foil having a plating of a metal selected from the group consisting of brass, bronze, copper, nickel, zinc, cadmium, indium and chromium, said metal plating containing fine particles of a substance electrically insulating and chemically and thermally stable, selected from the group consisting of silica, alumina, glass, barium sulfate and mixtures thereof, prepared by electroplating said copper foil as the cathode in a bath of a plating solution of said metal, said bath containing fine particles of said electrically insulating and chemically and thermally stable substance.
Dependencies are inferred from the claim text.