Support Substrate and Method for Producing a Support Substrate
AssigneeRogers Germany GmbH
InventorsTilo Welker, Karsten Schmidt, Stefan Britting
Life of this patent
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AssigneeRogers Germany GmbH
InventorsTilo Welker, Karsten Schmidt, Stefan Britting
Estimating the term…
A support substrate (1), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer (10) and—an insulating element (30), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer (10) and the insulating element (30) extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (1), a binding layer (12) is formed between the at least one metal layer (10) and the insulating element (30), and an adhesive layer (13) of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq.
1-15. (canceled)
A carrier substrate (1) as a carrier for electrical components, comprising:
Dependencies are inferred from the claim text.