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AssigneeNippon Denkai, Ltd.
InventorsHitoshi Yokono, Haruki Yokono, Masahiro Mikamo, Ryouichi Narushima, Takuya Iida, Yasuhiro Endo
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A copper clad laminate having a bonded side ensuring powerful adhesion between the copper foil and insulating layer, without providing protrusions on the copper foil or making roughing treatment or black treatment, by designing such a configuration that the copper foil has a metal layer on the side to be bonded with the insulating layer and the metal layer and insulating layer are cross-linked with each other by chemical bonds through sulfur atoms. Further, there is provided a multilayer printed circuit board which has a bonded side ensuring a powerful adhesion of the circuit copper foil and insulating layer, by designing such a configuration that the alternating metal layers and insulating layers are cross-linked with each other by chemical bonds through sulfur atoms.
A copper clad laminate having a bonded side between a copper foil and an insulating layer adhered to each other by lamination, wherein the copper foil has a metal layer on a side to be bonded with the insulating layer, wherein the metal layer comprises an alloy selected from the group consisting of Cu--Zn alloy, Ni--Zn alloy, Ni--Sn alloy, Ni--Cu alloy, Pd--P alloy and Ni--P alloy, and the metal layer and insulating layer are cross linked with each other by chemical bonds through sulfur atoms.
A multilayer printed circuit board having multilayered circuit copper foils laminated with insulating layers, said copper foils and said insulating layers being alternated with each other, the improvement wherein each of said multilayered circuit copper foils has a metal layer on its surface adhering to one of said insulating layers, wherein the metal layer comprises an alloy selected from the group consisting of Cu--Zn alloy, Ni--Zn alloy, Ni--Sn alloy, Ni--Cu alloy, Pd--P alloy and Ni--P alloy, and the metal layers and insulating layers are cross-linked by chemical bonds through sulfur atoms.
Dependencies are inferred from the claim text.