H05K 2201/10356
Cables
H05K2201/10356 (Cables) appears on 545 US grants and 596 published applications in this corpus.
Search patents in H05K- Granted patents
- 545
- Published applications
- 596
- Assignees
- 373
- Inventors
- 1,389
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 11 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 3 |
| 2002 | 12 | 6 |
| 2003 | 8 | 9 |
| 2004 | 8 | 11 |
| 2005 | 13 | 8 |
| 2006 | 2 | 14 |
| 2007 | 15 | 13 |
| 2008 | 7 | 15 |
| 2009 | 9 | 23 |
| 2010 | 17 | 19 |
| 2011 | 15 | 17 |
| 2012 | 8 | 15 |
| 2013 | 14 | 37 |
| 2014 | 26 | 25 |
| 2015 | 22 | 24 |
| 2016 | 19 | 19 |
| 2017 | 23 | 28 |
| 2018 | 23 | 32 |
| 2019 | 42 | 52 |
| 2020 | 47 | 49 |
| 2021 | 27 | 38 |
| 2022 | 31 | 33 |
| 2023 | 33 | 29 |
| 2024 | 27 | 28 |
| 2025 | 27 | 22 |
| 2026 | 19 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Ground connection for automotive shielded cables6 Oct 2026US 12,756,119 B1Infineon Technologies Americas Corp.
- Flexible connection member and electronic device including the same1 Sep 2026US 12,727,081 B2Samsung Electronics Co., Ltd.
- Compact interface through hinge connector25 Aug 2026US 12,720,678 B2Apple Inc.
- Fixed equipment, alignment system and method11 Aug 2026US 12,706,427 B2TE Connectivity Services GmbH
- Wire comb with curved arcuate section configured to engage a printed circuit board4 Aug 2026US 12,700,685 B2Vertiv Corporation
- Probe, measuring device, and power line monitoring system1 Oct 2026US 2026/0299050 A1Hydro-Quebec
- Substrate and cable assembly17 Sep 2026US 2026/0282228 A1Nissei Electric Co., Ltd.
- Circuit board and image forming apparatus17 Sep 2026US 2026/0282232 A1Canon Kabushiki Kaisha
- Blood pump10 Sep 2026US 2026/0266293 A1
- High density connector for superconducting applications20 Aug 2026US 2026/0246213 A1IQM Finland Oy
Most cited
By later US patents
- High speed bypass cable assembly141US 9,011,177 B2Molex Incorporated · 2015
- Multilayer printed circuit board and high-frequency circuit device using the same136US 5,828,555 AFujitsu Limited · 1998
- Backplane for radio frequency signals134US 6,392,160 B1Lucent Technologies Inc. · 2002
- Circuit board interconnection system, connector assembly, circuit board and method for manufacturing a circuit board112US 8,018,733 B2Huawei Technologies Co., Ltd. · 2011
- Method of making a wire harness111US 5,598,627 ASumitomo Wiring Systems, Ltd. · 1997