H05K 2201/10219
Thermoelectric component
H05K2201/10219 (Thermoelectric component) appears on 102 US grants and 137 published applications in this corpus.
Search patents in H05K- Granted patents
- 102
- Published applications
- 137
- Assignees
- 91
- Inventors
- 265
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 3 |
| 2007 | 2 | 2 |
| 2008 | 1 | 0 |
| 2009 | 0 | 2 |
| 2010 | 0 | 3 |
| 2011 | 0 | 1 |
| 2012 | 0 | 3 |
| 2013 | 1 | 4 |
| 2014 | 2 | 7 |
| 2015 | 3 | 9 |
| 2016 | 8 | 9 |
| 2017 | 3 | 5 |
| 2018 | 7 | 11 |
| 2019 | 2 | 7 |
| 2020 | 8 | 23 |
| 2021 | 10 | 14 |
| 2022 | 18 | 8 |
| 2023 | 17 | 8 |
| 2024 | 10 | 8 |
| 2025 | 5 | 6 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Optical transceiver module temperature control device and optical transceiver module temperature control method9 Jun 2026US 12,650,565 B2
- Cooling system with a plurality of substrates and projection device31 Mar 2026US 12,591,171 B2Coretronic Corporation
- Control board, electronic equipment, and image forming apparatus30 Sep 2025US 12,429,808 B2Ricoh Company, Ltd.
- Device for emitting light2 Sep 2025US 12,408,259 B2
- Aerosol generating device3 Jun 2025US 12,317,923 B2Kt&G Corporation
- Thermoelectric module10 Sep 2026US 2026/0271620 A1KYOCERA Corporation
- Temperature sensors and applications in wireless charging13 Aug 2026US 2026/0235451 A1Tesla, Inc.
- Loopback module30 Oct 2025US 2025/0338388 A1All Best Precision Technology Co., Ltd.
- Aerosol generating device14 Aug 2025US 2025/0255341 A1Kt&G Corporation
- Circuit board structure and electric compressor including the same31 Jul 2025US 2025/0247943 A1Mitsubishi Heavy Industries Thermal Systems, Ltd.
Most cited
By later US patents
- Flexible circuit for establishing electrical connectivity with optical subassembly98US 7,439,449 B1Finisar Corporation · 2008
- Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance48US 8,893,513 B2Phononic Device, Inc. · 2014
- Flexible interconnect structures for electrical devices and light sources incorporating the same26US 7,273,987 B2General Electric Company · 2007
- Passive bias temperature compensation circuit module15US 10,541,660 B2Jefferson Science Associates, LLC · 2020
- IC card having improved heat dissipation13US 5,508,885 AMitsubishi Denki Kabushiki Kaisha · 1996