Back to results
US 5,508,885 AGranted
IC card having improved heat dissipation
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorShin-ichi Ishimoto
Life of this patent
Estimating the term…
Abstract
An IC card includes a ground pattern of high heat conductivity disposed between a substrate and a mounted element, such as a semiconductor element, and in contact with the mounted element. Heat generated by the mounted element is transmitted through the ground pattern and ground terminals to which the ground pattern is connected and radiated by a cooling system disposed outside of the IC card. Therefore, heat generated by the mounted element can be radiated efficiently and malfunctioning of the mounted element due to heat can be prevented, resulting in improved electrical reliability.
Claims4
An IC card comprising:
- a frame including first, second, and third side walls;
- a connector having a terminal, mounted to said frame, and forming, with said frame, a four-sided structure;
- electrically and thermally conductive top and bottom panels disposed on opposite sides of said frame defining a closed volume within said frame between said top and bottom panels;
- a circuit board having opposed first and second surfaces and mounted at one end to said connector within the volume;
- a first heat-generating element mounted on said first surface of said circuit board;
- a first heat conduction path pattern disposed on the first surface of said circuit board partially between said circuit board and said first heat-generating element;
- and
- an electrically and thermally conducting member disposed within the volume and electrically and thermally connected to said top and bottom panels and to said first heat conduction path pattern.
5 more elements
Dependencies are inferred from the claim text.