Cooling system with a plurality of substrates and projection device

A projection device, comprising:

• a case, a projection system, and a cooling system, wherein
• the projection system is disposed in the case and is configured to project an image out of the projection device;
• the cooling system is disposed in the case and is configured to guide an air flow entering the case to cool at least a part of the projection system after dehumidifying and cooling down the air flow,
• the cooling system comprises a flow channel structure and a first cooling chip, wherein
• the first cooling chip has a cold side and a hot side opposite to each other;
• and
• the flow channel structure comprises a plurality of flow channel substrates, a first outer substrate, a first inner adsorption layer, a first outer adsorption layer, and a first heat insulating layer;
• the plurality of flow channel substrates surround to form an air flow channel, so that the flow channel structure has an air flow inlet and an air flow outlet, each of the plurality of flow channel substrates has a first surface and a second surface opposite to each other, and the first surface of one of the plurality of flow channel substrates is disposed in contact with the cold side of the first cooling chip;
• the first outer substrate has a first surface and a second surface opposite to each other, and the first surface of the first outer substrate is disposed in contact with the hot side of the first cooling chip;
• the first inner adsorption layer is disposed on the second surface of the flow channel substrate in contact with the first cooling chip;
• the first outer adsorption layer is disposed on the second surface of the first outer substrate;
• and
• the first heat insulating layer is disposed between the flow channel substrate in contact with the first cooling chip and the first outer substrate and surrounds the first cooling chip,
• wherein the first heat insulating layer comprises a plurality of vias, and each of the plurality of vias is filled with a porous adsorption material and is connected to the first inner adsorption layer and the first outer adsorption layer.