Flexible interconnect structures for electrical devices and light sources incorporating the same

A flexible interconnect structure comprising:

• a flexible dielectric film having two opposed surfaces, at least a portion of said dielectric film being removed through an entire thickness thereof, forming a plurality of removed portions;
• circuit traces disposed on at least one of said opposing surfaces, said removed portions being located where said circuit traces are not present;
• and
• a plurality of heat sinks coupled to a surface of said dielectric film, a first of said plurality of heat sinks covering at least one of said plurality of removed portions and less than one of said opposing surfaces of said flexible dielectric film, a second of said plurality of heat sinks covering at least one of said plurality of removed portions and less than one of said opposing surfaces of said flexible dielectric film, and a third of said plurality of heat sinks covering at least one of said plurality of removed portions and less than one of said opposing surfaces of said flexible dielectric film, the first heat sink being spaced from the second heat sink in a first direction and the first heat sink being spaced from the third heat sink in a second direction that is not parallel to the first direction.