H05K 13/0443
Incorporating means for treating the terminal leads before and after insertion or
Official title: {incorporating means for treating the terminal leads before and after insertion or only after insertion}
H05K13/0443 (Incorporating means for treating the terminal leads before and after insertion or) appears on 7 US grants and 1 published applications in this corpus.
Search patents in H05K- Granted patents
- 7
- Published applications
- 1
- Assignees
- 7
- Inventors
- 12
- Latest grant
- 9 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Substrate working machine9 Sep 2025US 12,414,280 B2Fuji Corporation
- Method of mounting electronic components on a circuit board20 Feb 1996US 5,491,890 ADelco Electronics Corporation
- Apparatus for automatically inserting leads on electrical and/or electronic components into corresponding holes in a substrate17 May 1988US 4,744,141 AArcotronics Italia S.p.A.
- Apparatus for handling and assembling axial electronic components on printed circuit cards8 Dec 1987US 4,711,015 AMetalmeccanica Gori & Zucchi MGZ S.p.A.
- Component lead processing apparatus10 Dec 1985US 4,557,043 ARCA Corporation
Most cited
By later US patents
- Component lead processing apparatus23US 4,557,043 ARCA Corporation · 1985
- Apparatus for handling and assembling axial electronic components on printed circuit cards19US 4,711,015 AMetalmeccanica Gori & Zucchi MGZ S.p.A. · 1987
- Automatic component mounting apparatus11US 4,087,034 AMatsushita Electric Industrial Co., Ltd. · 1978
- Apparatus for automatically inserting leads on electrical and/or electronic components into corresponding holes in a substrate11US 4,744,141 AArcotronics Italia S.p.A. · 1988
- Solid state chip insertion apparatus2US 4,015,764 ABurroughs Corporation · 1977