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US 2023/0093351 A1Published application
Substrate working machine
AssigneeFuji Corporation
InventorNoriaki IWAKI
Life of this patent
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Abstract
Provided is a substrate working machine including a holding device configured to hold a substrate in which multiple through-holes are formed, an inserting device configured to insert multiple terminals of a component into the multiple through-holes of the substrate held by the holding device, and an imaging device configured to simultaneously image a shape of a pair of pins and a pair of through-holes of the multiple through-holes, in which positions of the pair of through-holes and the shape of the pair of pins are calculated based on image data captured by the imaging device.
Claims4
A substrate working machine comprising:
- a holding device configured to hold a substrate in which multiple through-holes are formed;
- an inserting device configured to insert multiple terminals of a component into the multiple through-holes of the substrate held by the holding device;
- and
- an imaging device configured to simultaneously image a shape of a pair of pins and a pair of through-holes of the multiple through-holes,
- wherein positions of the pair of through-holes and the shape of the pair of pins are calculated based on image data captured by the imaging device.
2 more elements
Dependencies are inferred from the claim text.