Component lead processing apparatus

An apparatus for bending a plurality of leads of a component borne by a printed circuit board to secure the component to the board and for indicating the presence of the secured component on the board comprising:

• support means;
• means coupled to the support means for aligning the printed circuit board relative to the support means;
• bending means secured to the support means and aligned relative to said plurality of leads when said board is aligned, said bending means including movable drive means and at least first and second electrically conductive bending heads secured to said drive means, said drive means including means for electrically isolating said first and second bending heads, each head being located on said drive means for bending a corresponding lead in response to the movement of the drive means from an idle position to a bend position, each said head being adapted to be in electrical contact with said corresponding lead during said bending;
• means coupled to the support means for moving said drive means;
• and
• means electrically coupled to said bending heads for indicating said electrical contact with said lead and thereby the presence of said component;
• said drive means including a drive member having a channel, dielectric means in said channel having first and second spaced recesses, said first head being in said first recess, said second head being in said second recess.

Apparatus for securing a component to a printed circuit board and for testing a given electrical parameter of the component comprising:

• a support adapted to releasably secure a printed circuit board lying in a plane, said board carrying a component having first and second leads, which, when bent, secure the component to the board, said elements being electrically connected internal to said component, said internal connection exhibiting said electrical parameter having a given value;
• a pair of drive members secured to said support for rotation about a respective pair of corresponding axes;
• means secured to the support for rotating said drive members about their respective axes;
• first and second electrically conductive element bending heads, one head being secured to one of said drive members and the other head to the other drive member, said heads moving adjacent said plane in contact with and for bending said elements, when present, in response to the rotation of said members;
• dielectric means coupled to said heads for electrically isolating said heads from the corresponding members;
• and
• test means connected to said heads and responsive to the engagement of said heads with said elements to test said component;
• said dielectric means including a pair of dielectric members each having a channel, each said drive members including a recess for receiving a corresponding dielectric member, a different bending head being received in the channel of a corresponding dielectric member.

A printed circuit board component processing apparatus comprising:

• a support;
• means for aligning a printed circuit board relative to the support;
• first and second members secured to said support for movement relative to said support, said members each including a drive element and a component lead bending element adapted to bend the corresponding leads of a component on said aligned printed circuit board in response to said movement, each said bending element including a bending head secured in electrical isolation, said heads being located for engaging said corresponding lead to be bent, said engagement providing bending and electrical contact between said corresponding lead and head;
• means secured to the support and engaged with said drive element for moving said members and thereby bending said leads;
• and
• test means connected to said bending heads for indicating at least said electrical contact between said leads and heads;
• each said bending element including a channel, a dielectric element in said channel having at least one recess, said bending head being located in said recess, said dielectric element being between said head and said bending element, said dielectric element being sufficiently rigid so that forces for bending said lead are substantially transmitted from said bending head to said bending element through said dielectric element.