Back to results
US 4,015,764 AGranted
Solid state chip insertion apparatus
AssigneeBurroughs Corporation
InventorDavid John Durney
Life of this patent
Estimating the term…
Abstract
The present invention relates to semi-automatic apparatus for aligning and inserting a solid state electrical circuit chip or solid state chip receiving socket assembly into a printed circuit board or panel and automatically clinching a portion of the leads thereof so as to retain the chip and/or socket against accidental dislodgement from the circuit board prior to dip or wave soldering of the board.
Claims10
Solid state chip insertion apparatus comprising:
- chip insertion means including means arcuately movable from a chip receiving position to a chip insertion position for inserting a solid state chip into a printed circuit board;
- means for individually releasing said chips from a supply so as to move by gravity to said insertion means;
- means mounting a printed circuit board for adjustable positioning movement adjacent to said chip insertion means;
- detent template means carried by said printed circuit board mounting means for guiding said board to a predetermined chip location in rows and columns without visual alignment of said board and said chip;
- operator controlled means operably associated with said chip insertion means for actuating said insertion means effective to insert a chip into said printed circuit board;
- and
- clinching means for deforming the contacts of said chips to retain the chips within said printed circuit board so as to prevent accidental dislodgement therefrom after insertion of the chips into and through the board prior to soldering.
4 more elements
Dependencies are inferred from the claim text.