Substrate working machine

A substrate working machine comprising:

• a base material conveyance and holding device configured to convey and hold a substrate in which multiple through-holes are formed, the base material conveyance and holding device including a conveyance device and a clamp device;
• an component mounting device configured to insert multiple terminals of a component into the multiple through-holes of the substrate held by the base material conveyance and holding device, the component mounting device including a work head and a work head moving device;
• a jig configured to be held by the component mounting device, the jig including a main body and a pair of pins extending from the main body, a shape of the pair of pins being standardized;
• and
• a camera configured to simultaneously image the pair of pins and a pair of through-holes of the multiple through-holes;
• and
• a controller including a processor configured to
• control the component mounting device so that XY-coordinates of the pair of pins of the jig held by the component mounting device coincide with XY-coordinates of first and second through-holes of the multiple through-holes of the substrate, and end surfaces of the pair of pins are flush with a lower surface of the substrate in an up-down direction, and control the camera to acquire a first image data,
• control the component mounting device so that XY-coordinates of the pair of pins of the jig coincide with XY-coordinates of one of the first or second through-holes and a third through-hole of the multiple through-holes of the substrate, and end surfaces of the pair of pins are flush with a lower surface of the substrate in an up-down direction, and control the camera to acquire a second image data,
• calculate positions of the first, second, and third through-holes and the shape of the pair of pins based on the acquired first and second image data captured by the camera,
• calculate translational and angular deviation amounts between centers of the first and second through-holes and centers of the pair of pins, and centers of the one of the first or second through-holes and the third through-hole and centers of the pair of pins, calculate a correction value for inserting multiple terminals of a component into the multiple through-holes of the substrate by the component supply device based on the calculated deviation amounts, and control the component supply device to insert multiple terminals of a component into the multiple through-holes of the substrate based on the correction value.