H05K 13/027
Fluid transport of components
Official title: {Fluid transport of components}
H05K13/027 (Fluid transport of components) appears on 17 US grants and 13 published applications in this corpus.
Search patents in H05K- Granted patents
- 17
- Published applications
- 13
- Assignees
- 14
- Inventors
- 45
- Latest grant
- 15 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 2 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 0 |
| 2012 | 2 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 2 | 2 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 3 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 3 | 0 |
| 2025 | 2 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- System and method for controlling flow of solder in a wave soldering machine15 Jul 2025US 12,363,833 B2Illinois Tool Works Inc.
- System and method for controlling flow of solder in a wave soldering machine8 Jul 2025US 12,356,555 B2Illinois Tool Works Inc.
- Device for self-assembling semiconductor light-emitting diodes3 Dec 2024US 12,159,800 B2LG Electronics Inc.
- Apparatus and method for manufacturing light-emitting display device24 Sep 2024US 12,100,689 B2Samsung Display Co., Ltd.
- Substrate chuck for self-assembling semiconductor light emitting diodes13 Feb 2024US 11,901,208 B2LG Electronics Inc.
- System and method for controlling flow of solder in a wave soldering machine24 Apr 2025US 2025/0133663 A1Illinois Tool Works Inc.
- System and method for controlling flow of solder in a wave soldering machine24 Apr 2025US 2025/0133664 A1Illinois Tool Works Inc.
- Apparatus and method for manufacturing light-emitting display device14 Oct 2021US 2021/0320089 A1Samsung Display Co., Ltd.
- Device for self-assembling semiconductor light-emitting diodes25 Mar 2021US 2021/0090925 A1LG Electronics Inc.
- Substrate chuck for self-assembling semiconductor light emitting diodes25 Mar 2021US 2021/0090929 A1LG Electronics Inc.
Most cited
By later US patents
- Apparatus for forming an electronic assembly75US 7,080,444 B1Alien Technology Corporation · 2006
- Chip separation and alignment apparatus44US 4,801,044 ANitto Kogyo Co., Ltd. · 1989
- Chip separation and alignment apparatus27US 4,953,749 ANitto Kogyo Co., Ltd. · 1990
- Bulk component feeder19US 8,162,571 B2Panasonic Corporation · 2012
- Parts feed apparatus and parts feed method11US 5,853,108 AMatsushita Electric Industrial Co., Ltd. · 1998