Substrate chuck for self-assembling semiconductor light emitting diodes
AssigneeLG Electronics Inc.
InventorsInbum Yang, Imdeok Jung, Junghun Rho, Bongwoon Choi
Life of this patent
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Abstract
Discussed is a substrate chuck for allowing one surface of a substrate to be in contact with a fluid, the substrate chuck including a first frame having a hole at a central portion thereof; a second frame having a hole at a central portion thereof and disposed to overlap the first frame; and a frame transfer part configured to vertically move the second frame with respect to the first frame, wherein the first frame includes: a bottom portion at which the hole is formed; and a sidewall portion formed on a peripheral edge of the bottom portion, and wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid.
Claims19
A substrate chuck for allowing one surface of a substrate to be in contact with a fluid in an assembly chamber, the substrate chuck comprising:
- a first frame having a first hole at a central portion thereof;
- a second frame having a second hole at a central portion thereof and disposed to overlap the first frame, wherein the first frame comprises:
- a bottom portion at which the first hole is formed;
- and
- a sidewall portion formed on a peripheral edge of the bottom portion;
- and
- a frame transfer part connected to the second frame and configured to vertically move the second frame with respect to the first frame,
- wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid in the assembly chamber,
- wherein the first frame comprises a sealing part disposed at an edge of the first hole,
- wherein the first frame and the second frame are configured to be disposed at a first side and a second side of the substrate, respectively with the substrate interposed therebetween, and
- wherein the frame transfer part is configured to transfer the second frame so that a first surface of the substrate is in contact with the fluid while the second frame presses on a second surface of the substrate.
A substrate chuck for allowing one surface of a substrate to be in contact with a fluid in an assembly chamber, the substrate chuck comprising:
- a first frame having a first hole at a central portion thereof;
- a second frame having a second hole at a central portion thereof to overlap the first hole, and disposed to overlap the first frame;
- a frame transfer part connected to the second frame and configured to vertically move the second frame with respect to the first frame;
- and
- a sealing part disposed between the first hole and a sidewall portion of the first frame,
- wherein the first frame comprises:
- a bottom portion at which the first hole is formed;
- and
- the sidewall portion formed on a peripheral edge of the bottom portion,
- wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid in the assembly chamber,
- wherein the substrate is configured to be disposed between the first frame and the second frame,
- wherein the first frame allows a lower surface of the substrate to be exposed through the first hole and the second frame allows an upper surface of the substrate to be exposed through the second hole,
- wherein the sealing part is disposed between an upper surface of the first frame and a bottom surface of the second frame, and
- wherein the sealing part surrounds the first hole.
A substrate chuck for allowing one surface of a substrate to be in contact with a fluid in an assembly chamber, the substrate chuck comprising:
- a first frame having a first hole at a central portion thereof;
- and
- a second frame having a second hole at a central portion thereof and disposed to overlap the first frame, wherein the first frame comprises:
- a bottom portion at which the first hole is formed;
- and
- a sidewall portion formed on a peripheral edge of the bottom portion,
- wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid in the assembly chamber,
- wherein the first frame comprises a sealing part disposed at an edge of the first hole, and
- wherein the first frame comprises an electrode connection part configured to apply power to an assembly electrode provided at the substrate so as to generate an electric field.
Dependencies are inferred from the claim text.