H05B 3/143
Applied to semiconductors
Official title: {applied to semiconductors, e.g. wafers heating (H05B3/0047 takes precedence)}
H05B3/143 (Applied to semiconductors) appears on 184 US grants and 282 published applications in this corpus.
Search patents in H05B- Granted patents
- 184
- Published applications
- 282
- Assignees
- 72
- Inventors
- 402
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 3 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 1 |
| 2002 | 7 | 15 |
| 2003 | 4 | 28 |
| 2004 | 13 | 30 |
| 2005 | 18 | 25 |
| 2006 | 7 | 15 |
| 2007 | 8 | 14 |
| 2008 | 13 | 15 |
| 2009 | 5 | 10 |
| 2010 | 7 | 7 |
| 2011 | 5 | 2 |
| 2012 | 9 | 6 |
| 2013 | 5 | 1 |
| 2014 | 3 | 6 |
| 2015 | 2 | 5 |
| 2016 | 2 | 4 |
| 2017 | 5 | 7 |
| 2018 | 5 | 4 |
| 2019 | 3 | 9 |
| 2020 | 7 | 6 |
| 2021 | 2 | 18 |
| 2022 | 5 | 12 |
| 2023 | 1 | 14 |
| 2024 | 17 | 11 |
| 2025 | 13 | 12 |
| 2026 | 11 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate holding unit and substrate processing apparatus11 Aug 2026US 12,703,917 B2Samsung Electronics Co., Ltd.
- Ceramic heater23 Jun 2026US 12,666,503 B2NGK Insulators, Ltd.
- Tantalum nitride resistive heater for thermally-tunable photonics devices2 Jun 2026US 12,645,101 B2Newport Fab, LLC
- High heat capacity hot plate19 May 2026US 12,635,448 B2Tokyo Electron Limited
- Supporting unit and apparatus for treating substrate5 May 2026US 12,622,209 B2Semes Co., Ltd.
- Integral resistance heaters including niobium and processes for making same17 Sep 2026US 2026/0282171 A1Materion Corporation
- Ceramic Susceptor6 Aug 2026US 2026/0231298 A1MiCo Ceramics Ltd.
- Ceramic heater and method of manufacturing ceramic heater14 May 2026US 2026/0136436 A1NGK Insulators, Ltd.
- Ceramic heater5 Mar 2026US 2026/0067996 A1NGK Insulators, Ltd.
- Self-limiting thick film positive temperature coefficient of resistivity (ptcr) resistor compositions26 Feb 2026US 2026/0059614 A1Data Coating Technologies Ltd.
Most cited
By later US patents
- Wafer heating apparatus541US 6,753,507 B2KYOCERA Corporation · 2004
- Heater for heating a wafer and method for fabricating the same143US 7,361,865 B2KYOCERA Corporation · 2008
- Wafer holding member94US 6,133,557 AKYOCERA Corporation · 2000
- Load chamber with dual heaters72US 8,354,618 B1WD Media, LLC · 2013
- Wafer heating apparatus62US 6,080,970 AKYOCERA Corporation · 2000