US 6,753,507 B2 · Wafer heating apparatus

Abstract

In a ceramic heater having a plate-like body made of a ceramic, heating element in one main face of the plate like body, and an electric supply portion to be electrically connected with the heating element, it has been a problem that the temperature is uneven if bent portions are formed in heat generating patterns. The ceramic heater simultaneously satisfying the following: 0.15≦S≦0.85, 0.3≦P≦6.71×S2+1.52, and 0.3≦G≦6.71×(1−S)2+1.55, in which the reference character S1 denotes the surface area of the heating element in optional 10 mm square region of the effective heat generation area having the heating element therein; the surface ratio S denotes S=S1/100 mm2, the reference character P denotes the width of the heating element: and the reference character G denotes the gap between the heating element.

Claims11

Dependent claims

A wafer heating apparatus comprising:

a heat homogenizing plate of a ceramic having one main face for mounting a wafer;
a heating element composed of a plurality of resister strips which are attached on other main surface or inside thereof;
and electric supply portions electrically connected with the plurality of the resistor strips of the heating element;
wherein the heating element satisfies the following relations:
0.15≦S≦0.85,
0.3≦P≦6.71×S2+1.52, and
0.3≦G≦6.71×(1−S)2+1.55,
wherein S is the ratio of the total surface area of the resistor strips included within a 10 mm square region selected from within an effective heat generation area on the heat homogenizing plate;
P is the width of the resister strips in mm;
and G is a gap width in mm between the adjacent resister strips of the heating element.

7 more elements

Dependencies are inferred from the claim text.

Wafer heating apparatus

Life of this patent

Wafer heating apparatus

Life of this patent

Abstract

Claims11