H03H 2001/0071
Comprising zig-zag inductor
Official title: {comprising zig-zag inductor}
H03H2001/0071 (Comprising zig-zag inductor) appears on 20 US grants and 15 published applications in this corpus.
Search patents in H03H- Granted patents
- 20
- Published applications
- 15
- Assignees
- 11
- Inventors
- 38
- Latest grant
- 2 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 3 |
| 2004 | 2 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 2 |
| 2013 | 0 | 0 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 2 |
| 2021 | 1 | 2 |
| 2022 | 1 | 2 |
| 2023 | 1 | 0 |
| 2024 | 2 | 1 |
| 2025 | 2 | 0 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Module with high peak bandwidth I/O channels2 Dec 2025US 12,489,530 B2
- In-plane inductors in IC packages17 Jun 2025US 12,336,197 B2Intel Corporation
- Circuit device including an impedance matching network having at least one inductor formed by a film of superconductor material exhibiting kinetic sheet inductance26 Nov 2024US 12,155,363 B2Google Inc.
- Module with high peak bandwidth I/O channels13 Feb 2024US 11,901,956 B2
- Package-level noise filtering for EMI RFI mitigation31 Oct 2023US 11,804,454 B2Tahoe Research, Ltd.
- Circuit Device Including an Impedance matching Network Having a Kinetic Inductor30 Apr 2026US 2026/0121605 A1Google Inc.
- Module with high peak bandwidth i/o channels5 Mar 2026US 2026/0066997 A1
- Module with high peak bandwidth i/o channels4 Jul 2024US 2024/0223283 A1
- Module with high peak bandwidth i/o channels30 Jun 2022US 2022/0209871 A1
- Impedance matching using kinetic inductors27 Jan 2022US 2022/0029589 A1Google Inc.
Most cited
By later US patents
- High temperature superconducting structures and methods for high Q, reduced intermodulation resonators and filters59US 6,026,311 ASuperconductor Technologies, Inc. · 2000
- Passive electronic parts, IC parts, and wafer57US 6,329,715 B1TDK Corporation · 2001
- High temperature superconductor lumped element band-reject filters42US 5,616,539 ASuperconductor Technologies, Inc. · 1997
- High temperature superconductor lumped elements and circuit therefrom37US 5,618,777 ASuperconductor Technologies, Inc. · 1997
- LC noise filter34US 5,495,213 A1996