Module with high peak bandwidth i/o channels

A computing system that comprises one or more hybrid computing modules that further comprise at least one high peak bandwidth I/O channel embedded within a multilayer surface interface, wherein,

• the high peak bandwidth I/O link additionally comprises vias that form an electrical interface with input and output ports on a semiconductor die, a semiconductor carrier, or an interposer circuit embedded within the stacked assembly of semiconductor chips;
• the multilayer surface interface comprises conducting means that forms a channel link within a data signal plane that electrically interfaces signal transmission between the vias, low permittivity/ultra-low loss dielectric, additional conductive means to form power planes and ground planes, and
• the multilayer surface interface further comprises a passive network filtering circuit comprising capacitive, inductive, and resistive elements embedded within the high peak bandwidth I/O channel,
• wherein,
• the passive network filtering circuit further comprises high energy density electroceramic dielectric components that polarize and depolarize with femto-second response times.