High temperature superconductor lumped elements and circuit therefrom
AssigneeSuperconductor Technologies, Inc.
InventorsGregory L. Hey-Shipton, Roger J. Forse, David L. Skoglund
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AssigneeSuperconductor Technologies, Inc.
InventorsGregory L. Hey-Shipton, Roger J. Forse, David L. Skoglund
Estimating the term…
Lumped element electrical components, such as inductors and capacitors, are formed to include high temperature superconducting materials. In the preferred embodiment, thin film epitaxial high temperature superconductors are patterned to form capacitors and inductors on low loss substrates. Preferably, a ground plane is formed on the back side of the substrate, most preferably being formed of high temperature superconducting material, or other highly conductive materials such as gold or copper. Various advantageous structures include a planar spiral structure, a zig-zag serpentine structure, a single coil structure and a double coil structure. Single layer and multilayer structures are included. Improved narrow bandpass filters and high Q resonator structures are formed.
An electrical circuit comprising:
A method for reducing radiative losses in a high Q, lumped element device, the device including an inductor, the inductor being adapted to carry current through the inductor, the inductor including a plurality of substantially parallel runs connected in series, the method comprising the steps of:
A method for reducing radiative losses in a high frequency, high Q, lumped element device, the device including an inductor and a capacitive element, the inductor being disposed on a support, the inductor adapted to carry high frequency current at or above the radio frequency range through the inductor, the method comprising the steps of:
An electrical element comprising:
An electrical LC circuit comprising:
An electrical LC circuit comprising:
A lumped element inductor comprising:
A resonant circuit comprising:
An electrical resonant circuit comprising:
Dependencies are inferred from the claim text.