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US 6,329,715 B1Granted
Passive electronic parts, IC parts, and wafer
AssigneeTDK Corporation
InventorKatsuhiko Hayashi
Life of this patent
Estimating the term…
Abstract
Passive electronic parts containing a substrate (1) and a passive circuit (2). The substrate (1) has an inorganic insulating layer (11) composed of a mixture of a ceramic component and glass component. The passive circuit (2) is composed of a conductor pattern in general and provided on one surface (111) of the insulating layer (11). It is preferable to polish the surface (111) of the insulating layer (11) on which the circuit (2) is formed. An electronic part can be designed for a smaller pattern area by making the conductive pattern finer.
Claims14
A passive electronic part comprising:
- a substrate having an inorganic insulating layer comprising a mixture of a ceramic material and a glass material throughout the inorganic insulating layer, said inorganic insulating layer having a polished surface;
- and
- a passive circuit including at least one conductive pattern on the polished surface of said inorganic insulating layer.
An IC part comprising:
- at least one passive electronic part including:
- a substrate having an inorganic insulating layer comprising a mixture of a ceramic material and a glass material throughout the inorganic insulating layer, said inorganic insulating layer having a polished surface, and
- a passive circuit on the polished surface of said inorganic insulating layer, and
- including at least one conductive pattern on said polished surface,
- an insulating armor covering said passive electronic part;
- and
- a lead conductor connected to said passive electronic part inside said insulating armor to be led out to the outside of said insulating armor.
4 more elements
A wafer comprising:
- a substrate having an inorganic insulating layer comprising a mixture of a ceramic material and a glass material throughout the inorganic insulating layer, said inorganic insulating layer having a polished surface;
- and
- a plurality of passive electronic part elements including a conductor pattern on the polished surface of said inorganic insulating layer.
Dependencies are inferred from the claim text.