H01S 5/02423
Liquid cooling
Official title: {Liquid cooling, e.g. a liquid cools a mount of the laser}
H01S5/02423 (Liquid cooling) appears on 377 US grants and 387 published applications in this corpus.
Search patents in H01S- Granted patents
- 377
- Published applications
- 387
- Assignees
- 219
- Inventors
- 828
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 6 | 0 |
| 1992 | 9 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 11 | 0 |
| 1999 | 5 | 0 |
| 2000 | 7 | 0 |
| 2001 | 8 | 2 |
| 2002 | 7 | 6 |
| 2003 | 5 | 12 |
| 2004 | 10 | 8 |
| 2005 | 10 | 13 |
| 2006 | 8 | 17 |
| 2007 | 6 | 13 |
| 2008 | 7 | 17 |
| 2009 | 10 | 15 |
| 2010 | 8 | 10 |
| 2011 | 11 | 8 |
| 2012 | 10 | 8 |
| 2013 | 11 | 4 |
| 2014 | 9 | 14 |
| 2015 | 14 | 9 |
| 2016 | 6 | 14 |
| 2017 | 9 | 23 |
| 2018 | 21 | 28 |
| 2019 | 28 | 21 |
| 2020 | 17 | 29 |
| 2021 | 18 | 25 |
| 2022 | 13 | 23 |
| 2023 | 19 | 31 |
| 2024 | 23 | 19 |
| 2025 | 8 | 11 |
| 2026 | 13 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Corrosion resistant heatsink method, system, and apparatus22 Sep 2026US 12,744,358 B2nLIGHT, Inc.
- Method and system for using and cooling a portable high-powered laser18 Aug 2026US 12,712,334 B2Acme Solutions LLC
- Laser irradiation head and laser irradiation device4 Aug 2026US 12,700,711 B2Hamamatsu Photonics K.K.
- Method for producing a cooling element, and cooling element produced using such a method14 Jul 2026US 12,683,355 B2Rogers Germany GmbH
- Method for producing a cooling element, and cooling element produced using such a method7 Jul 2026US 12,677,661 B2Rogers Germany GmbH
- Laser irradiation apparatus and laser processing apparatus24 Sep 2026US 2026/0291167 A1Seiko Epson Corporation
- 3d package for semiconductor thermal management17 Sep 2026US 2026/0273956 A1Genesee Valley Innovations, LLC
- Infrared Heater / Dryer30 Apr 2026US 2026/0118055 A1Il-Vi Delaware, Inc.
- Method of manufacturing aluminum-copper integrated die-casting composite radiator for laser chip and radiator30 Apr 2026US 2026/0121375 A1Trio Metal (Gz) Co., Ltd
- Light emitting device and light emitting module16 Apr 2026US 2026/0106431 A1Furukawa Electric Co., Ltd.
Most cited
By later US patents
- Modular microchannel heat exchanger201US 5,727,618 A1998
- Laser diode module128US 5,065,226 AU. S. Philips Corporation · 1991
- Hybrid two-dimensional surface-emitting laser arrays121US 4,881,237 AMassachusetts Institute of Technology · 1989
- Modular package for cooling a laser diode array113US 5,105,429 AThe United States of America as represented by the Department of Energy · 1992
- Thin planar package for cooling an array of edge-emitting laser diodes113US 5,105,430 AThe United States of America as represented by the United States Department of Energy · 1992