Laser irradiation head and laser irradiation device
AssigneeHamamatsu Photonics K.K.
InventorAtsushi Fujihara
Life of this patent
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Abstract
A laser irradiation head includes: a semiconductor laser module including a semiconductor laser element and a lens; a heat sink having a flow path of a refrigerant; and a first pipe connector that a first pipe for supplying the refrigerant to the flow path is attachable to and detachable from. The heat sink has an outer surface including a first area and a second area being in a relationship of intersecting with the first area, the semiconductor laser module is screwed to the heat sink in the first area, and the first pipe connector is screwed to the heat sink in the second area.
Claims12
A laser irradiation head comprising:
- a semiconductor laser module including a semiconductor laser element and a lens;
- a heat sink having a flow path of a refrigerant;
- and
- a first pipe connector that a first pipe for supplying the refrigerant to the flow path is attachable to and detachable from,
- wherein the heat sink has an outer surface including a first area and a second area being in a relationship of intersecting with the first area,
- the semiconductor laser module is screwed to the heat sink in the first area,
- the first pipe connector is screwed to the heat sink in the second area,
- the semiconductor laser module is configured to emit laser light, in a direction along the first area, toward a side opposite to the second area, and
- the first pipe connector extends along a direction intersecting the second area, and is configured such that the first pipe is attachable to and detachable from the first pipe connector from a side opposite to the heat sink in the direction intersecting the second area.
A laser irradiation head comprising:
- a semiconductor laser module including a semiconductor laser element and a lens;
- a heat sink having a flow path of a refrigerant;
- a first pipe connector that a first pipe for supplying the refrigerant to the flow path is attachable to and detachable from;
- and
- an installation member disposed between the heat sink and the semiconductor laser module,
- wherein the heat sink has an outer surface including a first area and a second area being in a relationship of intersecting with the first area,
- the semiconductor laser module is screwed to the heat sink in the first area,
- the first pipe connector is screwed to the heat sink in the second area,
- the semiconductor laser module further includes a housing accommodating the semiconductor laser element, and a support member supporting the lens, and
- the housing and the support member are screwed to the heat sink in the first area with the installation member interposed therebetween.
Dependencies are inferred from the claim text.