H01S 5/0243
Laser is immersed in the coolant, i.e. the whole laser chip is
Official title: {Laser is immersed in the coolant, i.e. the whole laser chip is immersed in the liquid for cooling}
H01S5/0243 (Laser is immersed in the coolant, i.e. the whole laser chip is) appears on 14 US grants and 9 published applications in this corpus.
Search patents in H01S- Granted patents
- 14
- Published applications
- 9
- Assignees
- 15
- Inventors
- 32
- Latest grant
- 21 Mar 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 0 |
| 2003 | 1 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 2 |
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 1 | 2 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 1 | 1 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Embedded microfluidic distribution apparatus for passively cooling optoelectronic devices21 Mar 2023US 11,611,192 B2Accelsius, LLC
- Nanowire laser structure and fabrication method6 Aug 2019US 10,374,394 B2Technische Universitaet Muenchen
- Direct impingement cooling of fibers26 Jun 2018US 10,007,077 B2BAE Systems Information and Electronic Systems Integration Inc.
- Cooling disk lasers10 May 2016US 9,337,614 B1Trumpf Laser GmbH
- Laser diode with internal air cooling25 Aug 2015US 9,118,161 B2
- Embedded microfluidic distribution apparatus for passively cooling optoelectronic devices8 Apr 2021US 2021/0104863 A1Nokia Solutions and Networks Oy
- Nanowire Laser Structure and Fabrication Method6 Sep 2018US 2018/0254611 A1Technische Universitaet Muenchen
- Cooling disk lasers28 Apr 2016US 2016/0118766 A1Trumpf Laser GmbH
- Direct Impingement Cooling of Fibers1 Oct 2015US 2015/0277073 A1Bae Systems Inforamation and Electronic Systems Integration Inc.
- Laser Diode With Internal Air Cooling15 Jan 2015US 2015/0016481 A1
Most cited
By later US patents
- Immersion method and apparatus for cooling a semiconductor laser device32US 5,495,490 AMcDonnell Douglas Corporation · 1996
- Solid-state laser device capable of stably producing an output laser beam at high power27US 5,311,528 AHoya Corporation · 1994
- Laser diode package16US 5,262,675 ACray Research, Inc. · 1993
- Diode-laser system for hyperpolarized He-3 and Xe-129 gas generation and other applications14US 6,611,540 B12003
- Optically transparent, heat conductive fluid heat sink13US 6,480,515 B1Xerox Corporation · 2002