US 5,105,430 A · Thin planar package for cooling an array of edge-emitting laser diodes

Abstract

A laser diode array is disclosed that includes a plurality of planar assemblies and active cooling of each assembly. The laser diode array may be operated in a long duty cycle, or in continuous operation. A laser diode bar and a microchannel heat sink are thermally coupled in a compact, thin planar assembly having the laser diode bar located proximate to one edge. In an array, a number of such thin planar assemblies are secured together in a stacked configuration, in close proximity so that the laser diodes are spaced closely. The cooling means includes a microchannel heat sink proximate to the laser diode bar to absorb heat generated by laser operation. To provide the coolant to the microchannels, each thin planar assembly comprises passageways that connect the microchannels to inlet and outlet corridors. Each inlet passageway may comprise a narrow slot that directs coolant into the microchannels and increases the velocity of flow therethrough. The corridors comprises holes extending through each of the assemblies in the array. The inlet and outlet corridors are connected to a conventional coolant circulation system. The laser diode array with active cooling has applications as an optical pump for high power solid state lasers, or by mating the diodes with fiber optic lenses. Further, the arrays can be useful in applications having space constraints and energy limitations, and in military and space applications. The arrays can be incorporated in equipment such as communications devices and active sensors.

Claims24

Dependent claims

An apparatus for actively cooling a diode with a coolant pumped by a circulation system, said apparatus comprising:

a planar assembly thermally and electrically connected to the diode, said planar assembly comprising;
a plurality of microchannels actively cooled by the coolant, said microchannels being thermally connected to the diode so that heat is conducted between the diode and the microchannels,
a plurality of inlet corridors for providing coolant to the assembly,
a plurality of outlet corridors for removing coolant from the assembly,
a plurality of inlet passageways integral to the assembly, each of said inlet passageways positioned to provide coolant flow between one of the inlet corridors and one or more microchannels, and
a plurality of outlet passageways integral to the assembly, each of said outlet passageways positioned to provide coolant flow between one of the outlet corridors and one or more microchannels.

3 more elements

A planar assembly for actively cooling a diode with a coolant pumped by a circulation system, said planar assembly being thermally and electrically connected to the diode, said planar assembly comprising:

a plurality of microchannels actively cooled by the coolant, said microchannels being thermally connected to the diode so that heat is conducted between the diode and the microchannels;
a plurality of inlet corridors for providing coolant to the assembly;
a plurality of outlet corridors for removing coolant from the assembly;
a plurality of inlet passageways integral to the assembly, each of said inlet passageways positioned to provide coolant flow between one of the inlet corridors and one or more microchannels, each of said passageways including an inlet slot positioned for injecting the coolant into the microchannels, said coolant slot having a narrow cross-section relative to the inlet passageway so that coolant flow is increased in velocity as it flows from the inlet passageway through the narrow cross section, thereby injecting the coolant into the microchannels with increased velocity;
and,
a plurality of outlet passageways integral to the assembly, each of said outlet passageways positioned to provide coolant flow between one of the outlet corridors and one or more microchannels.

3 more elements

An array of laser diodes, comprising:

a plurality of planar assemblies actively cooled with a coolant circulation system, said assemblies being stacked to form the array, each of said assemblies further comprising;
a diode mounted on said planar assembly, said diode being thermally and electrically connected to the assembly,
a plurality of microchannels actively cooled by the coolant, said microchannels being thermally connected to the diode so that heat is conducted between the diode and the microchannels,
a plurality of inlet corridors to provide coolant flow between the assembly and the coolant circulation system,
a plurality of outlet corridors to remove coolant flow from the assembly to the coolant circulation system,
a plurality of inlet passageways integral to the assembly, each of said inlet passageways positioned to provide coolant flow between one of the inlet corridors and one or more microchannels, and
a plurality of outlet passageways integral to the assembly, each of said outlet passageways positioned to provide coolant flow between one of the outlet corridors and one or more microchannels.

4 more elements

Dependencies are inferred from the claim text.

Thin planar package for cooling an array of edge-emitting laser diodes

Life of this patent

Thin planar package for cooling an array of edge-emitting laser diodes

Life of this patent

Abstract

Claims24